发明申请
- 专利标题: CHIP TYPE LAMINATED CAPACITOR
- 专利标题(中): 芯片型层压电容器
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申请号: US13531242申请日: 2012-06-22
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公开(公告)号: US20120327557A1公开(公告)日: 2012-12-27
- 发明人: Young Ghyu AHN , Byoung Hwa Lee , Min Cheol Park , Young Hoon Song , Mi Hee Lee
- 申请人: Young Ghyu AHN , Byoung Hwa Lee , Min Cheol Park , Young Hoon Song , Mi Hee Lee
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权: KR10-2011-0061345 20110623
- 主分类号: H01G4/12
- IPC分类号: H01G4/12
摘要:
There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less.
公开/授权文献
- US08351181B1 Chip type laminated capacitor 公开/授权日:2013-01-08
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