Provided are a metal tape material improved in characteristics to be low in Young's modulus, low in yield stress and high in break elongation and a metal tape material for semiconductor packaging, such as a current-collection interconnector, comprising the same.The metal tape material comprises a metal having face centered cubic lattice structure, in which metal tape material an area fraction A1 of a preferentially oriented region in which crystal axes of a unit lattice of the face centered cubic structure are within an orientation difference of 15° relative to a thickness direction of the metal tape material and further within an orientation difference of 15° relative to a first in-plane direction of the metal tape material is 60% or greater and not greater than 100%, and, where an area fraction of a preferentially oriented region in which crystal axes of the unit lattice of the face centered cubic structure are within an orientation difference of 15° relative to the thickness direction of the metal tape material and further within an orientation difference of 15° relative to the first in-plane direction of the metal tape material is defined as A2, the total of the area fraction of the preferentially oriented region and the area fraction of the preferentially oriented region, A1+A2, is greater than 70% and not greater than 100%.