发明申请
- 专利标题： MULTILAYER POLYMIDE FILM AND FLEXIBLE METAL LAMINATED BOARD
- 专利标题（中）： 多层聚合物薄膜和柔性金属层压板
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申请号： US13522546申请日： 2011-01-13
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公开(公告)号： US20130011687A1公开(公告)日： 2013-01-10
- 发明人: Teruo Matsutani , Yasutaka Kondo , Shogo Fujimoto , Shinji Matsukubo , Hisayasu Kaneshiro
- 申请人： Teruo Matsutani , Yasutaka Kondo , Shogo Fujimoto , Shinji Matsukubo , Hisayasu Kaneshiro
- 申请人地址： JP Osaka-shi, Osaka
- 专利权人： KANEKA CORPORATION
- 当前专利权人： KANEKA CORPORATION
- 当前专利权人地址： JP Osaka-shi, Osaka
- 优先权： JP2010-008294 20100118
- 国际申请： PCT/JP2011/050420 WO 20110113
- 主分类号： B32B15/08
- IPC分类号： B32B15/08 ; B32B27/06
摘要：
Provided are a multilayer polyimide film that hardly suffers from the peeling of the layers from each other or the clouding of a space between the layers (turning white in color) during heating at a high temperature and a flexible metal-clad laminate using such a multilayer polyimide film. This object can be attained by a multilayer polyimide film having a thermoplastic polyimide layer on at least one side of a nonthermoplastic polyimide layer, wherein at least 60% of the total number of moles of an acid dianhydride monomer and a diamine monomer that constitute the thermoplastic polyimide is the same type of monomer as at least one type of acid dianhydride monomer and at least one type of diamine monomer that constitute the nonthermoplastic polyimide.