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公开(公告)号：US08993108B2
公开(公告)日：2015-03-31
申请号：US12671719
申请日：2008-07-18
CPC分类号： H05K1/0346 , B32B7/02 , B32B7/12 , B32B15/08 , B32B27/08 , B32B27/20 , B32B27/281 , B32B27/34 , B32B2307/206 , B32B2307/50 , B32B2307/51 , B32B2307/546 , B32B2307/734 , B32B2457/08 , H05K1/036 , H05K2201/0154 , H05K2201/068 , Y10T428/24942 , Y10T428/2495 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： An object of this invention is to provide a polyimide film suitable for use in flexible printed circuit boards and the like which have high flexibility and dimensional stability, and to provide a laminate and metal-clad laminate which uses such a polyimide film. This invention relates to a multilayer polyimide film being a polyimide film having a multilayer structure, including: a core layer; and clad layers provided on each side of the film, which clad layers are exposed, the core layer being a non-thermoplastic polyimide having an average coefficient of linear expansion at a temperature from 100° C. to 200° C. in a range of 5 ppm/° C. to 20 ppm/° C., each of the clad layers being a polyimide having a peeling strength of 3 N/cm or less, the film as a whole having an average coefficient of linear expansion at a temperature range of 100° C. to 200° C. in a range of 9 ppm/° C. to 30 ppm/° C., and (a)>(b), where (a) is an average modulus of elasticity of the core layer and (b) is an average modulus of elasticity of the clad layers.
摘要翻译： 本发明的目的是提供一种适用于具有高柔性和尺寸稳定性的柔性印刷电路板等的聚酰亚胺膜，并且提供使用这种聚酰亚胺膜的层压体和覆金属层压板。 本发明涉及一种具有多层结构的聚酰亚胺膜的多层聚酰亚胺膜，包括：芯层; 在覆盖层露出的膜的两面上设置覆层，芯层是在100℃〜200℃的温度范围内具有平均线膨胀系数的非热塑性聚酰亚胺 5ppm /℃至20ppm /℃，每个包覆层是剥离强度为3N / cm以下的聚酰亚胺，该膜在整个温度范围内具有平均线性膨胀系数 （a）>（b），其中（a）是芯的平均弹性模量， 层和（b）是包层的平均弹性模量。
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公开(公告)号：US08293331B2
公开(公告)日：2012-10-23
申请号：US13369957
申请日：2012-02-09
CPC分类号： H05K1/0346 , B32B15/08 , B32B27/28 , C08G73/101 , C08L79/08 , H05K1/0393 , H05K3/388 , H05K2201/0154 , H05K2203/065 , Y10T428/31681 , Y10T428/31721
摘要： A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.
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公开(公告)号：US20090011223A1
公开(公告)日：2009-01-08
申请号：US12087935
申请日：2007-01-04
IPC分类号： B32B27/20
CPC分类号： C08J5/18 , C08J2379/08 , H05K1/0346 , H05K1/0373 , H05K2201/0154 , H05K2201/0209 , H05K2203/0759 , Y10T428/254
摘要： Disclosed is a polyimide film which is free from coarse particles caused by aggregation of a filler, therefore, can avoid abnormal electrical discharge during a discharge treatment, repelling during application of an adhesive, and the like. Also disclosed is a method for production of the polyimide film. The method for production of the polyimide film is characterized by using an organic solvent solution containing an inorganic filling material and a first polyamic acid, wherein the organic solvent solution containing the first polyamic acid is prepared by a process comprising the steps of: 1) preparing a dispersion solution which contains the inorganic filling material and a second polyamic acid and has a viscosity of 50 to 500 poises; 2) filtering the dispersion solution; 3) mixing a prepolymer solution containing the first polyamic acid in the process of being polymerized and having a viscosity of 100 poises or lower with the filtered dispersion solution; and 4) increasing the viscosity of the mixed solution to a level ranging from 1000 to 6000 poises.
摘要翻译： 公开了一种聚酰亚胺膜，其不含由填料聚集引起的粗颗粒，因此可以避免在放电处理期间的异常放电，在施加粘合剂期间的排斥等。 还公开了一种聚酰亚胺薄膜的制造方法。 聚酰亚胺薄膜的制造方法的特征在于，使用含有无机填充材料和第一聚酰胺酸的有机溶剂溶液，其中含有第一聚酰胺酸的有机溶剂溶液是通过以下步骤制备的：1）制备 包含无机填充材料和第二聚酰胺酸并具有50至500泊的粘度的分散溶液; 2）过滤分散液; 3）在聚合过程中混合含有第一聚酰胺酸的预聚物溶液，并用过滤的分散液混合粘度为100泊或更低; 和4）将混合溶液的粘度提高至1000至6000泊。
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公开(公告)号：US20130011687A1
公开(公告)日：2013-01-10
申请号：US13522546
申请日：2011-01-13
CPC分类号： H05K1/036 , B32B15/08 , B32B27/08 , B32B27/281 , B32B2457/08 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08L79/08 , H05K1/0346 , H05K2201/0129 , H05K2201/0154 , Y10T428/31681 , Y10T428/31721
摘要： Provided are a multilayer polyimide film that hardly suffers from the peeling of the layers from each other or the clouding of a space between the layers (turning white in color) during heating at a high temperature and a flexible metal-clad laminate using such a multilayer polyimide film. This object can be attained by a multilayer polyimide film having a thermoplastic polyimide layer on at least one side of a nonthermoplastic polyimide layer, wherein at least 60% of the total number of moles of an acid dianhydride monomer and a diamine monomer that constitute the thermoplastic polyimide is the same type of monomer as at least one type of acid dianhydride monomer and at least one type of diamine monomer that constitute the nonthermoplastic polyimide.
摘要翻译： 提供了一种多层聚酰亚胺膜，其难以在高温加热期间彼此剥离或层之间的空间（白色变白）和使用这种多层的柔性覆金属层压板的混浊 聚酰亚胺薄膜。 该目的可以通过在非热塑性聚酰亚胺层的至少一侧上具有热塑性聚酰亚胺层的多层聚酰亚胺膜来实现，其中构成热塑性树脂的酸二酐单体和二胺单体的总摩尔数的至少60％ 聚酰亚胺是与至少一种类型的酸二酐单体和构成非热塑性聚酰亚胺的至少一种二胺单体相同类型的单体。
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公开(公告)号：US20110033682A1
公开(公告)日：2011-02-10
申请号：US12671719
申请日：2008-07-18
CPC分类号： H05K1/0346 , B32B7/02 , B32B7/12 , B32B15/08 , B32B27/08 , B32B27/20 , B32B27/281 , B32B27/34 , B32B2307/206 , B32B2307/50 , B32B2307/51 , B32B2307/546 , B32B2307/734 , B32B2457/08 , H05K1/036 , H05K2201/0154 , H05K2201/068 , Y10T428/24942 , Y10T428/2495 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721
摘要： An object of this invention is to provide a polyimide film suitable for use in flexible printed circuit boards and the like which have high flexibility and dimensional stability, and to provide a laminate and metal-clad laminate which uses such a polyimide film. This invention relates to a multilayer polyimide film being a polyimide film having a multilayer structure, including: a core layer; and clad layers provided on each side of the film, which clad layers are exposed, the core layer being a non-thermoplastic polyimide having an average coefficient of linear expansion at a temperature from 100° C. to 200° C. in a range of 5 ppm/° C. to 20 ppm/° C., each of the clad layers being a polyimide having a peeling strength of 3 N/cm or less, the film as a whole having an average coefficient of linear expansion at a temperature range of 100° C. to 200° C. in a range of 9 ppm/° C. to 30 ppm/° C., and (a)>(b), where (a) is an average modulus of elasticity of the core layer and (b) is an average modulus of elasticity of the clad layers.
摘要翻译： 本发明的目的是提供一种适用于具有高柔性和尺寸稳定性的柔性印刷电路板等的聚酰亚胺膜，并且提供使用这种聚酰亚胺膜的层压体和覆金属层压板。 本发明涉及一种具有多层结构的聚酰亚胺膜的多层聚酰亚胺膜，包括：芯层; 在覆盖层露出的膜的两面上设置的覆盖层，芯层是在100℃〜200℃的温度范围内具有平均线膨胀系数的非热塑性聚酰亚胺 5ppm /℃至20ppm /℃，每个包覆层是剥离强度为3N / cm以下的聚酰亚胺，该膜在整个温度范围内具有平均线性膨胀系数 （a）>（b），其中（a）是芯的平均弹性模量， 层和（b）是包层的平均弹性模量。
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公开(公告)号：US20100143729A1
公开(公告)日：2010-06-10
申请号：US11989851
申请日：2006-07-26
IPC分类号： B32B15/088
CPC分类号： H05K1/0346 , C08G73/1067 , C08L79/08 , C23C14/205 , H05K1/024 , H05K1/0393 , H05K2201/0154 , Y10T428/31681
摘要： Disclosed is a flexible metal clad laminate plate with good appearance which can be manufactured by a metalizing method such as evaporation coating, sputtering or plating. The flexible metal clad laminate plate has a polyimide film. The polyamide film is produced by reacting an aromatic diamine with an aromatic acid dianhydride to produce a polyamide acid and then imidizing the polyamide. The polyamide film has (A) an inflexion point of the storage modulus falling within the range from 270 to 340° C., (B) the peak top of tan δ; (which is a value given by dividing the loss modulus by the storage modulus) falling within the range from 320 to 410° C., (C) the storage modulus at 400° C. falling within the range from 0.5 to 1.5 GPa, and (D) the storage modulus α1 (GPa) at the inflexion point and the storage modulus α2 (GPa) at 400° C. both falling within the range satisfying Formula (1) below 85≧{(α1−α2)/α1}×100≧70. (Formula 1)
摘要翻译： 公开了一种具有良好外观的柔性金属包覆层压板，其可以通过诸如蒸发涂覆，溅射或电镀的金属化方法制造。 柔性金属包覆层压板具有聚酰亚胺膜。 通过使芳族二胺与芳香族酸二酐反应制造聚酰胺酸，然后使聚酰胺酰亚胺化来制造聚酰胺薄膜。 聚酰胺膜具有（A）储能模量的拐点在270〜340℃的范围内，（B）tanδ的峰顶; （其是通过将损耗模量除以储能模量给出的值）落在320至410℃的范围内，（C）在400℃下的储能模量落在0.5至1.5GPa的范围内，以及 （D）在屈服点处的储能模量α1（GPa）和在400℃下的储能模量α2（GPa）均低于满足式（1）的范围低于85≥{（α1-α2）/α1}× 100≧70。 （公式1）
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公开(公告)号：US20120156388A1
公开(公告)日：2012-06-21
申请号：US13369957
申请日：2012-02-09
CPC分类号： H05K1/0346 , B32B15/08 , B32B27/28 , C08G73/101 , C08L79/08 , H05K1/0393 , H05K3/388 , H05K2201/0154 , H05K2203/065 , Y10T428/31681 , Y10T428/31721
摘要： A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.
摘要翻译： 金属涂覆的聚酰亚胺膜的长期粘合可靠性优异，具有各种尺寸稳定性，特别适用于FPC，COF和TAB应用。 金属涂覆的聚酰亚胺膜包括非热塑性聚酰亚胺膜; 并且不使用粘合剂直接形成在所述非热塑性聚酰亚胺膜的一个表面或两个表面上的金属层，其中所述非热塑性聚酰亚胺膜包含具有热塑性聚酰亚胺嵌段组分的非热塑性聚酰亚胺树脂。
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公开(公告)号：US08158268B2
公开(公告)日：2012-04-17
申请号：US12012275
申请日：2008-02-01
IPC分类号： B32B15/08
CPC分类号： H05K1/0346 , B32B15/08 , B32B27/28 , C08G73/101 , C08L79/08 , H05K1/0393 , H05K3/388 , H05K2201/0154 , H05K2203/065 , Y10T428/31681 , Y10T428/31721
摘要： A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.
摘要翻译： 金属涂覆的聚酰亚胺膜的长期粘合可靠性优异，具有各种尺寸稳定性，特别适用于FPC，COF和TAB应用。 金属涂覆的聚酰亚胺膜包括非热塑性聚酰亚胺膜; 并且不使用粘合剂直接形成在所述非热塑性聚酰亚胺膜的一个表面或两个表面上的金属层，其中所述非热塑性聚酰亚胺膜包含具有热塑性聚酰亚胺嵌段组分的非热塑性聚酰亚胺树脂。
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公开(公告)号：US20080182112A1
公开(公告)日：2008-07-31
申请号：US12012275
申请日：2008-02-01
CPC分类号： H05K1/0346 , B32B15/08 , B32B27/28 , C08G73/101 , C08L79/08 , H05K1/0393 , H05K3/388 , H05K2201/0154 , H05K2203/065 , Y10T428/31681 , Y10T428/31721
摘要： A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.
摘要翻译： 金属涂覆的聚酰亚胺膜的长期粘合可靠性优异，具有各种尺寸稳定性，特别适用于FPC，COF和TAB应用。 金属涂覆的聚酰亚胺膜包括非热塑性聚酰亚胺膜; 并且不使用粘合剂直接形成在所述非热塑性聚酰亚胺膜的一个表面或两个表面上的金属层，其中所述非热塑性聚酰亚胺膜包含具有热塑性聚酰亚胺嵌段组分的非热塑性聚酰亚胺树脂。
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