发明申请
US20130017650A1 COATING FOR A MICROELECTRONIC DEVICE, TREATMENT COMPRISING SAME,AND METHOD OF MANAGING A THERMAL PROFILE OF A MICROELECTRONIC DIE
有权
用于微电子器件的涂覆，包含其的处理以及管理微电子热模型的热轮廓的方法
- 专利标题： COATING FOR A MICROELECTRONIC DEVICE, TREATMENT COMPRISING SAME,AND METHOD OF MANAGING A THERMAL PROFILE OF A MICROELECTRONIC DIE
- 专利标题（中）： 用于微电子器件的涂覆，包含其的处理以及管理微电子热模型的热轮廓的方法
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申请号： US13613650申请日： 2012-09-13
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公开(公告)号： US20130017650A1公开(公告)日： 2013-01-17
- 发明人: Dingying Xu , Leonel R. Arana , Nachiket R. Raravikar , Mohit Mamodia , Rajasekaran Swaminathan , Rahul Manepalli
- 申请人： Dingying Xu , Leonel R. Arana , Nachiket R. Raravikar , Mohit Mamodia , Rajasekaran Swaminathan , Rahul Manepalli
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; B32B27/00
摘要：
A coating for a microelectronic device comprises a polymer film (131) containing a filler material (232). The polymer film has a thermal conductivity greater than 3 W/m·K and a thickness (133) that does not exceed 10 micrometers. The polymer film may be combined with a dicing tape (310) to form a treatment (300) that simplifies a manufacturing process for a microelectronic package (100) and may be used in order to manage a thermal profile of the microelectronic device.
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