公开(公告)号：US20090004317A1

公开(公告)日：2009-01-01

申请号：US11772200

申请日：2007-06-30

Applicant: Xuejiao Hu ,  Leonel R. Arana ,  Robert M. Nickerson ,  Rahul N. Manepalli ,  Dingying Xu

Inventor： Xuejiao Hu ,  Leonel R. Arana ,  Robert M. Nickerson ,  Rahul N. Manepalli ,  Dingying Xu

IPC: B28B5/00 ,  C09K5/00

CPC classification number: C09K5/14

Abstract: A molding compound for use in an integrated circuit package comprises an epoxy and a thermally conductive filler material. The thermally conductive filler material comprises between 70% and 95% of the molding compound and has a thermal conductivity between 10 W/m-K and 3000 W/m-K.

Abstract translation: 用于集成电路封装的模塑料包括环氧树脂和导热填料。 该导热填料包含70％至95％的模塑料，其导热率在10W / m-K至3000W / m-K之间。

公开(公告)号：US20170276700A1

公开(公告)日：2017-09-28

申请号：US15083082

申请日：2016-03-28

Applicant: Joseph D. Stanford ,  David Craig ,  Todd P. Albertson ,  Mohit Mamodia ,  Dingying Xu

Inventor： Joseph D. Stanford ,  David Craig ,  Todd P. Albertson ,  Mohit Mamodia ,  Dingying Xu

IPC: G01R1/073 ,  G01R31/28 ,  G01R3/00

Abstract: A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a first pin end anchored to a substrate. At least a partial length of each of the pins is coated with a hydrophobic monolayer. The conductive pins may be composite metal wires including a core metal encased by one or more peripheral metal. At a tip of the pins, opposite the first pin end anchored to the substrate, the peripheral metals are recessed from the core metal. In further embodiments, the hydrophobic monolayer is disposed on an outer surface of the peripheral metals, but is substantially absent from a surface of the core metal exposed at the tip.

公开(公告)号：US09068067B2

公开(公告)日：2015-06-30

申请号：US12890545

申请日：2010-09-24

Applicant: Dingying Xu ,  Nisha Ananthakrishnan ,  Hong Dong ,  Rahul N. Manepalli ,  Nachiket Raravikar ,  Gregory S. Constable

Inventor： Dingying Xu ,  Nisha Ananthakrishnan ,  Hong Dong ,  Rahul N. Manepalli ,  Nachiket Raravikar ,  Gregory S. Constable

IPC: C04B41/49 ,  C08L83/00 ,  C08G77/00 ,  C08L63/00 ,  C08G65/48 ,  C08L23/08 ,  H01L21/56 ,  H01L23/29 ,  C08G59/32 ,  C08G59/38 ,  H01L23/00

CPC classification number: C08G59/02 ,  C07F7/0838 ,  C08G59/3254 ,  C08G59/38 ,  C08L23/0884 ,  H01L21/563 ,  H01L23/293 ,  H01L24/16 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3512 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed.

Abstract translation: 描述了用于制造电子设备的底部填充材料。 一个实施方案包括含有环氧混合物，胺硬化剂组分和填料的底部填充组合物。 环氧混合物可包括包含双酚环氧树脂的第一环氧树脂，包含多官能环氧树脂的第二环氧树脂和包含脂族环氧树脂的第三环氧树脂，所述脂族环氧树脂包含硅氧烷环氧树脂。 第一，第二和第三环氧树脂各自具有不同的化学结构。 描述和要求保护其他实施例。

公开(公告)号：US20140167217A1

公开(公告)日：2014-06-19

申请号：US13719836

申请日：2012-12-19

Applicant: Chuan Hu ,  Dingying Xu ,  Yoshihiro Tomita

Inventor： Chuan Hu ,  Dingying Xu ,  Yoshihiro Tomita

IPC: H01L23/538 ,  H01L21/768

CPC classification number: H01L25/50 ,  H01L21/561 ,  H01L21/568 ,  H01L21/76838 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27002 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/2784 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having one or more dies connected to an integrated circuit substrate by an interface layer. In one embodiment, the interface layer may include an anisotropic portion configured to conduct electrical signals in the out-of-plane direction between one or more components, such as a die and an integrated circuit substrate. In another embodiment, the interface layer may be a dielectric or electrically insulating layer. In yet another embodiment, the interface layer may include an anisotropic portion that serves as an interconnect between two components, a dielectric or insulating portion, and one or more interconnect structures that are surrounded by the dielectric or insulating portion and serve as interconnects between the same or other components. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及具有通过界面层连接到集成电路基板的一个或多个管芯的集成电路（IC）封装的技术和配置。 在一个实施例中，界面层可以包括各向异性部分，其被配置为在诸如管芯和集成电路基板的一个或多个部件之间的面外方向上传导电信号。 在另一个实施例中，界面层可以是介电层或电绝缘层。 在另一个实施例中，界面层可以包括用作两个部件之间的互连的各向异性部分，电介质或绝缘部分，以及由电介质或绝缘部分包围并用作相互之间的互连的一个或多个互连结构 或其他组件。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20130256909A1

公开(公告)日：2013-10-03

申请号：US13992511

申请日：2011-09-08

Applicant: Dingying Xu ,  Xavier F. Brun

Inventor： Dingying Xu ,  Xavier F. Brun

IPC: H01L21/82 ,  C09J7/02

CPC classification number: H01L21/82 ,  C09J7/20 ,  C09J2201/28 ,  C09J2203/326 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/24331

Abstract: The present disclosure relates to the field of fabricating microelectronic devices, wherein a microelectronic device substrate, such as a microelectronic wafer, may be thinned by a backgrinding process using a patterned adhesive tape that reduces slurry seepage and adhesive contamination. The patterned adhesive tape may comprise a base film and adhesive material patterned on the base film such that an edge or periphery portion of the microelectronic device substrate may contact the adhesive material, but substantially no adhesive material contacts interconnectors formed on the microelectronic device substrate.

Abstract translation: 本公开涉及制造微电子器件的领域，其中微电子器件衬底（例如微电子晶片）可以通过使用减少浆液渗漏和粘合剂污染的图案化胶带的背面研磨工艺来减薄。 图案化的胶带可以包括在基膜上图案化的基膜和粘合剂材料，使得微电子器件基板的边缘或周边部分可以接触粘合剂材料，但是基本上没有粘合剂材料接触形成在微电子器件基板上的互连器。

公开(公告)号：US20130017650A1

公开(公告)日：2013-01-17

申请号：US13613650

申请日：2012-09-13

Applicant: Dingying Xu ,  Leonel R. Arana ,  Nachiket R. Raravikar ,  Mohit Mamodia ,  Rajasekaran Swaminathan ,  Rahul Manepalli

Inventor： Dingying Xu ,  Leonel R. Arana ,  Nachiket R. Raravikar ,  Mohit Mamodia ,  Rajasekaran Swaminathan ,  Rahul Manepalli

IPC: H01L21/78 ,  B32B27/00

CPC classification number: H01L23/3737 ,  H01L24/81 ,  H01L2924/12042 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/265 ,  Y10T428/3154 ,  H01L2924/00

Abstract: A coating for a microelectronic device comprises a polymer film (131) containing a filler material (232). The polymer film has a thermal conductivity greater than 3 W/m·K and a thickness (133) that does not exceed 10 micrometers. The polymer film may be combined with a dicing tape (310) to form a treatment (300) that simplifies a manufacturing process for a microelectronic package (100) and may be used in order to manage a thermal profile of the microelectronic device.

Abstract translation: 用于微电子器件的涂层包括含有填料（232）的聚合物膜（131）。 聚合物膜的热导率大于3W / m·K，厚度（133）不超过10微米。 聚合物膜可以与切割带（310）组合以形成简化微电子封装（100）的制造工艺的处理（300），并且可以用于管理微电子器件的热分布。

公开(公告)号：US20120153494A1

公开(公告)日：2012-06-21

申请号：US12972161

申请日：2010-12-17

Applicant: Rahul N. Manepalli ,  Mohit Mamodia ,  Dingying Xu ,  Javier S. Gonzalez ,  Edward R. Prack

Inventor： Rahul N. Manepalli ,  Mohit Mamodia ,  Dingying Xu ,  Javier S. Gonzalez ,  Edward R. Prack

IPC: H01L25/11 ,  H01L21/50

CPC classification number: H01L25/50 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/24 ,  H01L25/0657 ,  H01L2225/06527 ,  H01L2924/10253 ,  H01L2924/10523 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.

Abstract translation: 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法可以包括将图案化的模具背面薄膜（DBF）附接到模具的背面，其中图案化的DBF包括围绕设置在模具背面的至少一个穿过硅通孔（TSV）垫的开口。

公开(公告)号：US20100264536A1

公开(公告)日：2010-10-21

申请号：US12826398

申请日：2010-06-29

Applicant: Ravi Shankar ,  Nachiket R. Raravikar ,  Dingying Xu

Inventor： Ravi Shankar ,  Nachiket R. Raravikar ,  Dingying Xu

IPC: H01L23/34

CPC classification number: H01L23/433 ,  H01L23/3675 ,  H01L23/3737 ,  H01L2224/32245 ,  H01L2924/16152 ,  H01L2924/3511

Abstract: A semiconductor package is described. The semiconductor package includes an internal housing and a semiconductor die coupled with the internal housing by a layer of self-healing thermal interface material.

Abstract translation: 描述半导体封装。 半导体封装包括内部壳体和通过一层自愈热界面材料与内部壳体耦合的半导体管芯。

公开(公告)号：US20150270235A1

公开(公告)日：2015-09-24

申请号：US14218767

申请日：2014-03-18

Applicant: Mihir A. Oka ,  Edward R. Prack ,  Dingying Xu ,  Saikumar Jayaraman

Inventor： Mihir A. Oka ,  Edward R. Prack ,  Dingying Xu ,  Saikumar Jayaraman

IPC: H01L23/00 ,  C09D179/04 ,  C08K11/00 ,  C09D181/04 ,  C09D179/08 ,  H01L21/02 ,  C09D125/02

CPC classification number: H01L24/11 ,  C08G73/22 ,  C09D5/20 ,  C09D7/63 ,  C09D179/04 ,  C09D179/08 ,  C09D181/04 ,  H01L21/02112 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/02318 ,  H01L21/31127 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/11009 ,  H01L2224/11332 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11849 ,  H01L2224/13023 ,  H01L2924/095 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00 ,  C08L83/04

Abstract: Techniques are disclosed for protecting a surface using a dry-removable protective coating that does not require chemical solutions to be removed. In an embodiment, a protective layer is disposed on a surface. The protective layer is composed of one layer that adheres to the surface. The surface is then processed while the protective coating is on the surface. Thereafter, the protective layer is removed from the surface by separating the protective layer away from the surface without the use of chemical solutions.

Abstract translation: 公开了用于使用不需要除去化学溶液的可干燥去除的保护涂层来保护表面的技术。 在一个实施例中，保护层设置在表面上。 保护层由附着在表面上的一层组成。 然后在表面上保护表面进行处理。 此后，通过将保护层从表面分离而不使用化学溶液，从表面除去保护层。

公开(公告)号：US08304065B2

公开(公告)日：2012-11-06

申请号：US12655282

申请日：2009-12-28

Applicant: Leonel Arana ,  Dingying Xu ,  Vijay Wakharkar ,  Wen Feng ,  Nirupama Chakrapani ,  Shankar Ganapathysubramanian ,  Jorge Sanchez ,  Mohit Mamodia

Inventor： Leonel Arana ,  Dingying Xu ,  Vijay Wakharkar ,  Wen Feng ,  Nirupama Chakrapani ,  Shankar Ganapathysubramanian ,  Jorge Sanchez ,  Mohit Mamodia

IPC: B32B7/02

CPC classification number: H01L21/6836 ,  H01L23/3164 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/81007 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/10253 ,  Y10T428/24124 ,  Y10T428/2419 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/25 ,  Y10T428/2839 ,  Y10T428/2852 ,  Y10T428/31703 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A treatment for a microelectronic device comprises a dicing tape (110) and a polymer composite film (120) having a pigment or other colorant added thereto and, in some embodiments, a pre-cure glass transition temperature greater than 50° Celsius. The film can comprise multiple layers, with one layer being tacky and the other layer non-tacky at a given temperature.

Abstract translation: 微电子器件的处理包括切割带（110）和添加有颜料或其它着色剂的聚合物复合膜（120），并且在一些实施方案中，预固化玻璃化转变温度大于50℃。 膜可以包括多层，一层是粘性的，另一层在给定温度下是非粘性的。