发明申请
US20130021050A1 Resonant test probe for integrated circuits 审中-公开
用于集成电路的谐振测试探头

  • 专利标题: Resonant test probe for integrated circuits
  • 专利标题(中): 用于集成电路的谐振测试探头
  • 申请号: US13137084
    申请日: 2011-07-20
  • 公开(公告)号: US20130021050A1
    公开(公告)日: 2013-01-24
  • 发明人: Ka Ng ChuiWang Zhili
  • 申请人: Ka Ng ChuiWang Zhili
  • 申请人地址: US CA Santa Clara
  • 专利权人: Corad Technology Inc.
  • 当前专利权人: Corad Technology Inc.
  • 当前专利权人地址: US CA Santa Clara
  • 主分类号: G01R31/20
  • IPC分类号: G01R31/20
Resonant test probe for integrated circuits
摘要:
A resonant test probe for testing high-speed integrated circuit devices. The test probe includes a probe tip that makes electrical contact with a device under test to receive a test signal from the device, and an output circuit transmits the received test signal to a testing apparatus. The test probe also includes tuning circuitry coupled between the probe tip and the output circuit. The tuning circuitry is configured to tune a resonance frequency of the test probe to be substantially equal to an operating frequency of the device under test to enable the test probe to transmit the test signal to the device under test.
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