摘要:
A resonant test probe for testing high-speed integrated circuit devices. The test probe includes a probe tip that makes electrical contact with a device under test to receive a test signal from the device, and an output circuit transmits the received test signal to a testing apparatus. The test probe also includes tuning circuitry coupled between the probe tip and the output circuit. The tuning circuitry is configured to tune a resonance frequency of the test probe to be substantially equal to an operating frequency of the device under test to enable the test probe to transmit the test signal to the device under test.
摘要:
A probe card includes a printed circuit board (PCB) and a probe ring coupled to the PCB. The probe card further includes a plurality of probes coupled to the PCB and to the probe card, and includes a plurality of tubes respectively associated with the plurality of probes. Each tube is configured to surround at least a portion of the probe that the tube is associated with. Each tube includes an inner dielectric portion and an outer conductive portion. The conductive portion of each tube is electrically coupled to the PCB.
摘要:
A compressible contact pin. The contact pin includes a first contact element and a second contact element. A compressible member is coupled between the first contact element and the second contact element to compress when one or more external forces are applied between the first contact element and the second contact element. In addition, the compressible member maintains a separation distance between the first and second contact elements when no external forces are applied. An elastomeric connector is coupled between the first contact element and the second contact element. The elastomeric connector electrically couples the first contact element to the second contact element by deforming when the one or more external forces are applied between the first contact element and the second contact element.
摘要:
A compressible contact pin. The contact pin includes a first contact element and a second contact element. A compressible member is coupled between the first contact element and the second contact element to compress when one or more external forces are applied between the first contact element and the second contact element. In addition, the compressible member maintains a separation distance between the first and second contact elements when no external forces are applied. A plurality of conductive particles is bounded by the compressible member to form an electrical connection between the first contact element and the second contact element. The conductive particles are configured to compress with one another when the compressible member is compressed.
摘要:
A compressible contact pin. The contact pin includes a first contact element and a second contact element. A compressible member is coupled between the first contact element and the second contact element to compress when one or more external forces are applied between the first contact element and the second contact element. In addition, the compressible member maintains a separation distance between the first and second contact elements when no external forces are applied. An elastomeric connector is coupled between the first contact element and the second contact element. The elastomeric connector electrically couples the first contact element to the second contact element by deforming when the one or more external forces are applied between the first contact element and the second contact element.
摘要:
A compressible contact pin. The contact pin includes a first contact element and a second contact element. A compressible member is coupled between the first contact element and the second contact element to compress when one or more external forces are applied between the first contact element and the second contact element. In addition, the compressible member maintains a separation distance between the first and second contact elements when no external forces are applied. A deformable conductor is electrically coupled between the first contact element and the second contact element. The deformable conductor maintains the electrical coupling between the first contact element and the second contact element by deforming when the one or more external forces are applied between the first contact element and the second contact element.
摘要:
A probe card for testing integrated circuit devices. The probe card includes a first circuit having a plurality of traces disposed thereon. The probe card also includes a plurality of pins to couple to a device under test. An interface element interfaces a first set of pins of the plurality of pins with the plurality of traces on the first circuit. The interface element includes a conductive plane coupled to a second set of pins of the plurality of pins to provide power and ground to the device under test.
摘要:
A detachable probe card interface comprises a space transformer, a deformable connector, and a carrier board. The space transformer includes first electrical contacts and second electrical contacts, wherein the first electrical contacts are coupled to the second electrical contacts through one or more layers of the space transformer. The deformable connector includes a plurality of conductive particles arranged in columns coinciding with the second electrical contacts, wherein the conductive particles compress with one another when one or more forces are exerted on the deformable connector. The carrier board includes a plurality of vias aligned with the plurality of second electrical contacts on the space transformer, and a plurality of conductors disposed within the vias. Each of the conductors is coupled to a respective one of the second electrical contacts and protrudes into the deformable connector to establish a transmission path between the second electrical contact and one or more columns of the conductive particles.
摘要:
A probe card interface for interfacing a probe head with a first circuit. The probe card interface includes an impedance control element to interface a first set of pins of the probe head with the first circuit. The impedance control element is further configured to control the impedance of the first set of pins. The probe card interface includes a conductive plane to interface a second set of pins of the probe head with the first circuit. The conductive plane is further coupled to provide at least one of power or ground to the second set of pins.
摘要:
A method of assembling a probe head for a probe card interface is disclosed. The probe head includes a plurality of alignment plates, wherein each of the alignment plates includes a set of holes. The plurality of alignment plates are stacked so that each of the alignment plates is adjacent to at least one other alignment plate and a set of holes in each of the alignment plates is aligned with a corresponding set of holes in each of the remaining alignment plates. A set of probe wires is then inserted through the set of holes, respectively, in each of the plurality of alignment plates. After the set of probe wires are inserted, the plurality of alignment plates are spaced so that none of the plurality of alignment plates is adjacent to another alignment plate. One or more multi-piece spacers may be used to space the alignment plates.