发明申请
- 专利标题： METHOD OF PRIMERLESS BONDING
- 专利标题（中）： 无连接方法
-
申请号： US13352771申请日： 2012-01-18
-
公开(公告)号： US20130029074A1公开(公告)日： 2013-01-31
- 发明人: Syed Z. Mahdi , Marcy N. Burris , Michelle M. Henderson
- 申请人： Syed Z. Mahdi , Marcy N. Burris , Michelle M. Henderson
- 申请人地址： US MI Midland
- 专利权人： DOW GLOBAL TECHNOLOGIES LLC
- 当前专利权人： DOW GLOBAL TECHNOLOGIES LLC
- 当前专利权人地址： US MI Midland
- 主分类号： C09J175/04
- IPC分类号： C09J175/04 ; B60J1/00
摘要：
The present invention relates to methods for attaching a plastic component to another component where the plastic component is bonded to the other component with an adhesive in the absence of a primer on the plastic component and the adhesive is substantially solvent free. In one embodiment, a coated transparent or translucent polycarbonate substrate is connected to a frame with a polyurethane adhesive containing silicon in the absence of a primer on the substrate; or with a substantially solvent free adhesive. The inventions also related to bonded articles made according to the disclosed methods.
公开/授权文献
- US08778128B2 Method of primerless bonding 公开/授权日：2014-07-15
信息查询
IPC分类:
