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公开(公告)号:US20130029074A1
公开(公告)日:2013-01-31
申请号:US13352771
申请日:2012-01-18
IPC分类号: C09J175/04 , B60J1/00
CPC分类号: C09J175/04 , B29C65/484 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/723 , B29K2069/00 , B32B7/12 , B32B27/08 , B32B27/16 , B32B27/283 , B32B27/285 , B32B27/365 , B32B27/40 , B32B2250/24 , B32B2250/40 , B32B2255/10 , B32B2307/412 , B32B2605/006 , C08G18/10 , C08G18/289 , C08J5/128 , C08J2369/00 , C08L71/00 , C08L75/00 , C08L83/00 , C09J5/00 , C09J2400/226 , Y10T428/31507
摘要: The present invention relates to methods for attaching a plastic component to another component where the plastic component is bonded to the other component with an adhesive in the absence of a primer on the plastic component and the adhesive is substantially solvent free. In one embodiment, a coated transparent or translucent polycarbonate substrate is connected to a frame with a polyurethane adhesive containing silicon in the absence of a primer on the substrate; or with a substantially solvent free adhesive. The inventions also related to bonded articles made according to the disclosed methods.
摘要翻译: 本发明涉及将塑料部件连接到另一部件上的方法,其中塑料部件在塑料部件上没有底漆的情况下用粘合剂粘合到另一部件上,并且粘合剂基本上是无溶剂的。 在一个实施方案中,涂覆的透明或半透明聚碳酸酯基材在框架上连接,所述框架具有在基底上不含底漆的含硅的聚氨酯粘合剂; 或使用基本上无溶剂的粘合剂。 本发明还涉及根据所公开的方法制成的粘结制品。