发明申请
- 专利标题： CLEANING RESIDUAL MOLDING COMPOUND ON SOLDER BUMPS
- 专利标题（中）： 焊剂上清洁残留模塑料
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申请号： US13198767申请日： 2011-08-05
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公开(公告)号： US20130034956A1公开(公告)日： 2013-02-07
- 发明人: Yi-Yang LEI , Hung-Jui KUO , Chung-Shi LIU , Mirng-Ji LII , Chen-Hua YU
- 申请人： Yi-Yang LEI , Hung-Jui KUO , Chung-Shi LIU , Mirng-Ji LII , Chen-Hua YU
- 申请人地址： TW Hsin-Chu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L21/28
- IPC分类号： H01L21/28
摘要：
A method of forming wafer-level chip scale packaging solder bumps on a wafer substrate involves cleaning the surface of the solder bumps using a laser to remove any residual molding compound from the surface of the solder bumps after the solder bumps are reflowed and a liquid molding compound is applied and cured.
公开/授权文献
- US08748306B2 Cleaning residual molding compound on solder bumps 公开/授权日：2014-06-10
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