发明申请
US20130051128A1 FLY-OVER CONDUCTOR SEGMENTS IN INTEGRATED CIRCUITS WITH SUCCESSIVE LOAD DEVICES ALONG A SIGNAL PATH
有权
集成电路中的FLY-OVER导体部分与信号路径中的连续负载设备
- 专利标题: FLY-OVER CONDUCTOR SEGMENTS IN INTEGRATED CIRCUITS WITH SUCCESSIVE LOAD DEVICES ALONG A SIGNAL PATH
- 专利标题(中): 集成电路中的FLY-OVER导体部分与信号路径中的连续负载设备
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申请号: US13221081申请日: 2011-08-30
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公开(公告)号: US20130051128A1公开(公告)日: 2013-02-28
- 发明人: Hsiao-Wen Lu , Wei-Jer Hsieh , Chiting Cheng , Chung-Cheng Chou , Jonathan Tsung-Yung Chang
- 申请人: Hsiao-Wen Lu , Wei-Jer Hsieh , Chiting Cheng , Chung-Cheng Chou , Jonathan Tsung-Yung Chang
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: G11C11/00
- IPC分类号: G11C11/00 ; H02J1/00 ; H03H11/26 ; G11C7/00
摘要:
The propagation delay of a signal through multiple load devices coupled sequentially along a conductor is improved by separating a subset of the load devices that is more distant from the signal source, and coupling the more distant subset to the signal through a fly-over conductor that bypasses the subset that is nearer to the signal source. The technique is applicable to subsets of bit cells in a random access memory (SRAM) coupled to a given word line, or to word line decoder gates coupled sequentially to a strobe signal, as well as other circuits wherein load devices selectable as a group can be divided into subsets by proximity to the signal source. In an SRAM layout with multiple levels, different metal deposition layers carry the conductor legs between the load devices versus the fly-over conductor bypassing the nearer subset.
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