Invention Application
US20130069622A1 ELECTRON RADIATION MONITORING SYSTEM TO PREVENT GOLD SPITTING AND RESIST CROSS-LINKING DURING EVAPORATION
审中-公开
电子辐射监测系统，用于防止蒸发期间发生黄金泄漏和电阻交叉
- Patent Title: ELECTRON RADIATION MONITORING SYSTEM TO PREVENT GOLD SPITTING AND RESIST CROSS-LINKING DURING EVAPORATION
- Patent Title (中): 电子辐射监测系统，用于防止蒸发期间发生黄金泄漏和电阻交叉
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Application No.: US13678765Application Date: 2012-11-16
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Publication No.: US20130069622A1Publication Date: 2013-03-21
- Inventor: Kezia Cheng
- Applicant: SKYWORKS SOLUTIONS, INC.
- Applicant Address: US MA Woburn
- Assignee: SKYWORKS SOLUTIONS, INC.
- Current Assignee: SKYWORKS SOLUTIONS, INC.
- Current Assignee Address: US MA Woburn
- Main IPC: G01N27/00
- IPC: G01N27/00 ; H01L21/02
Abstract:
Disclosed herein are systems and methods for in-situ measurement of impurities on metal slugs utilized in electron-beam metal evaporation/deposition systems, and for increasing the production yield of a semiconductor manufacturing processes utilizing electron-beam metal evaporation/deposition systems. A voltage and/or a current level on an electrode disposed in a deposition chamber of an electron-beam metal evaporation/deposition system is monitored and used to measure contamination of the metal slug. Should the voltage or current reach a certain level, to the deposition is completed and the system is inspected for contamination.
Public/Granted literature
- US09068918B2 Electron radiation monitoring system to prevent gold spitting and resist cross-linking during evaporation Public/Granted day:2015-06-30
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