Invention Application
- Patent Title: COMPOSITION AND METHOD FOR POLISHING ALUMINUM SEMICONDUCTOR SUBSTRATES
- Patent Title (中): 用于抛光铝半导体衬底的组合物和方法
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Application No.: US13237881Application Date: 2011-09-20
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Publication No.: US20130072021A1Publication Date: 2013-03-21
- Inventor: Ji Cui , Steven Grumbine , Glenn Whitener , Chih-An Lin
- Applicant: Ji Cui , Steven Grumbine , Glenn Whitener , Chih-An Lin
- Main IPC: H01L21/306
- IPC: H01L21/306 ; C09K13/00
Abstract:
The invention provides a chemical-mechanical polishing composition comprising coated α-alumina particles, an organic carboxylic acid, and water. The invention also provides a chemical-mechanical polishing composition comprising an abrasive having a negative zeta potential in the polishing composition, an organic carboxylic acid, at least one alkyldiphenyloxide disulfonate surfactant, and water, wherein the polishing composition does not further comprise a heterocyclic compound. The abrasive is colloidally stable in the polishing composition. The invention further provides methods of polishing a substrate with the aforesaid polishing compositions.
Public/Granted literature
- US08623766B2 Composition and method for polishing aluminum semiconductor substrates Public/Granted day:2014-01-07
Information query
IPC分类:
