Invention Application
- Patent Title: Flux Composition And Method Of Soldering
- Patent Title (中): 焊剂组成和焊接方法
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Application No.: US13250007Application Date: 2011-09-30
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Publication No.: US20130082095A1Publication Date: 2013-04-04
- Inventor: Kim S. Ho , Michael K. Gallagher , Avin V. Dhoble , Mark R. Winkle , Xiang-Qian Liu , David Fleming
- Applicant: Kim S. Ho , Michael K. Gallagher , Avin V. Dhoble , Mark R. Winkle , Xiang-Qian Liu , David Fleming
- Applicant Address: US MA Marlborough
- Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
- Current Assignee Address: US MA Marlborough
- Main IPC: B23K1/20
- IPC: B23K1/20 ; B23K35/363

Abstract:
A flux composition is provided, comprising, as an initial component: a carboxylic acid; and, a fluxing agent represented by formula I: wherein R1, R2, R3 and R4 are independently selected from a hydrogen, a substituted C1-80 alkyl group, an unsubstituted C1-80 alkyl group, a substituted C7-80 arylalkyl group and an unsubstituted C7-80 arylalkyl group; and wherein zero to three of R1, R2, R3 and R4 is(are) a hydrogen. Also provided is a method of soldering an electrical contact using the flux composition.
Public/Granted literature
- US08434666B2 Flux composition and method of soldering Public/Granted day:2013-05-07
Information query
IPC分类: