Invention Application
- Patent Title: MULTI-PATTERNING LITHOGRAPHY AWARE CELL PLACEMENT IN INTEGRATED CIRCUIT DESIGN
- Patent Title (中): 集成电路设计中的多图形图形识别芯片布局
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Application No.: US13248711Application Date: 2011-09-29
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Publication No.: US20130086543A1Publication Date: 2013-04-04
- Inventor: Kanak Behari Agarwal , Charles Jay Alpert , Zhuo Li , Gi-Joon Nam , Natarajan Viswanathan
- Applicant: Kanak Behari Agarwal , Charles Jay Alpert , Zhuo Li , Gi-Joon Nam , Natarajan Viswanathan
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method, system, and computer program product for multi-patterning lithography (MPL) aware cell placement in integrated circuit (IC) design are provided in the illustrative embodiments. A global phase of cell movement is performed. A local phase cell movement is performed, wherein the local phase includes moving a color instance of the cell from a plurality of color instances of the cell within a row of cell in the IC design, wherein the global phase and the local phase are each performed before a final placement is produced for the IC design.
Public/Granted literature
- US08495548B2 Multi-patterning lithography aware cell placement in integrated circuit design Public/Granted day:2013-07-23
Information query