Invention Application
US20130087271A1 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD 有权
制造印刷电路板的方法

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
Abstract:
A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.
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