Invention Application
- Patent Title: METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- Patent Title (中): 制造印刷电路板的方法
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Application No.: US13688413Application Date: 2012-11-29
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Publication No.: US20130087271A1Publication Date: 2013-04-11
- Inventor: Tetsuya OOSAWA , Naoyuki TANAKA , Mitsuru HONJO
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP2009-077246 20090326
- Main IPC: H05K3/10
- IPC: H05K3/10

Abstract:
A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.
Public/Granted literature
- US09095064B2 Method for manufacturing printed circuit board Public/Granted day:2015-07-28
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