公开(公告)号：US20140338958A1

公开(公告)日：2014-11-20

申请号：US14448253

申请日：2014-07-31

Applicant: Nitto Denko Corporation

Inventor： Daisuke YAMAUCHI ,  Tetsuya OOSAWA ,  Mitsuru HONJO ,  Masami INOUE

IPC: H05K1/05 ,  H05K3/24 ,  C25D7/00

CPC classification number: H05K1/056 ,  C25D7/00 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/28 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/10977 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.

Abstract translation: 基体绝缘层形成在悬架体上。 在基底绝缘层上一体地形成电镀用引线和布线迹线。 覆盖绝缘层形成在基底绝缘层上以覆盖电镀用引线和布线迹线。 在形成有电镀用引线的基极绝缘层的区域的上方的覆盖绝缘层的一部分的厚度设定为小于基底绝缘层的其它区域以上的覆盖绝缘层的一部分的厚度。

公开(公告)号：US20130087271A1

公开(公告)日：2013-04-11

申请号：US13688413

申请日：2012-11-29

Applicant: Nitto Denko Corporation

Inventor： Tetsuya OOSAWA ,  Naoyuki TANAKA ,  Mitsuru HONJO

IPC: H05K3/10

CPC classification number: H05K3/10 ,  G11B5/484 ,  G11B5/486 ,  H05K1/025 ,  H05K1/028 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/055 ,  Y10T156/1002 ,  Y10T156/1034

Abstract: A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.

Abstract translation: 在绝缘层上形成基极绝缘层，在基底绝缘层上形成写入布线迹线和读取布线迹线。 写入布线迹线和读取布线迹线形成在基底绝缘层的主体区域上，并且写入布线迹线形成在基底绝缘层的辅助区域上。 基底绝缘层沿弯曲部弯曲。 这将使写入布线轨迹位于写入布线轨迹的上方。