Invention Application
US20130091348A1 SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY THERMAL MANAGEMENT METHOD OF MULTICHIP PACKAGE
有权
移动设备的表面温度管理方法和多媒体封装的存储器热管理方法
- Patent Title: SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY THERMAL MANAGEMENT METHOD OF MULTICHIP PACKAGE
- Patent Title (中): 移动设备的表面温度管理方法和多媒体封装的存储器热管理方法
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Application No.: US13617619Application Date: 2012-09-14
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Publication No.: US20130091348A1Publication Date: 2013-04-11
- Inventor: Heungkyu KWON , Jae Choon KIM , Eunseok CHO , Jichul KIM
- Applicant: Heungkyu KWON , Jae Choon KIM , Eunseok CHO , Jichul KIM
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2011-0102804 20111010
- Main IPC: G06F9/06
- IPC: G06F9/06
Abstract:
A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.
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