公开(公告)号：US20170047264A1

公开(公告)日：2017-02-16

申请号：US15235958

申请日：2016-08-12

申请人： YUNHYEOK IM ,  OLEG FEYGENSON ,  SANG IL KIM ,  YOUNGBAE KIM ,  JICHUL KIM ,  SEUNGKON MOK ,  JUNGSU HA

发明人： YUNHYEOK IM ,  OLEG FEYGENSON ,  SANG IL KIM ,  YOUNGBAE KIM ,  JICHUL KIM ,  SEUNGKON MOK ,  JUNGSU HA

IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L21/56 ,  H01L23/31 ,  H01L23/29

CPC分类号： H01L23/367 ,  H01L21/4871 ,  H01L21/563 ,  H01L23/36 ,  H01L23/3736 ,  H01L23/49816 ,  H01L23/552 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

摘要： Semiconductor packages and methods of fabricating the same are disclosed. The semiconductor package may include a package substrate, a semiconductor chip, which is mounted on the package substrate to have a bottom surface facing the package substrate and a top surface opposite to the bottom surface, a mold layer provided on the package substrate to encapsulate the semiconductor chip, and a heat dissipation layer provided on the top surface of the semiconductor chip. The mold layer may have a top surface substantially coplanar with the top surface of the semiconductor chip, and the top surfaces of the semiconductor chip and the mold layer may have a difference in surface roughness from each other.

摘要翻译： 公开了半导体封装及其制造方法。 半导体封装可以包括封装衬底，半导体芯片，其安装在封装衬底上以具有面向封装衬底的底表面和与底表面相对的顶表面;模具层，设置在封装衬底上以封装 半导体芯片和设置在半导体芯片的顶表面上的散热层。 模具层可以具有与半导体芯片的顶表面基本上共面的顶表面，并且半导体芯片和模具层的顶表面可以具有彼此不同的表面粗糙度。

公开(公告)号：US09228763B2

公开(公告)日：2016-01-05

申请号：US13692394

申请日：2012-12-03

申请人： Jae Choon Kim ,  Jichul Kim ,  Jin-Kwon Bae ,  Eunseok Cho

发明人： Jae Choon Kim ,  Jichul Kim ,  Jin-Kwon Bae ,  Eunseok Cho

IPC分类号： H01L35/32 ,  F25B21/02

CPC分类号： F25B21/02 ,  F25B2321/0212 ,  F25B2700/2107 ,  H01L35/32 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.

摘要翻译： 提供热电冷却封装及其热管理方法。 该方法可以包括测量包括半导体芯片和热电冷却器的热电冷却封装的温度，将热电冷却封装的温度与目标温度进行比较，当热电冷却封装的温度高于 目标温度，并且当热电冷却封装的温度变得低于目标温度时，停止热电冷却器的操作。

公开(公告)号：US09030826B2

公开(公告)日：2015-05-12

申请号：US13535967

申请日：2012-06-28

申请人： Jichul Kim ,  Jae Choon Kim ,  Young-deuk Kim ,  Eunseok Cho

发明人： Jichul Kim ,  Jae Choon Kim ,  Young-deuk Kim ,  Eunseok Cho

IPC分类号： H05K7/20 ,  H01L23/34 ,  H01L23/498 ,  H01L23/36 ,  H01L23/373

CPC分类号： H01L23/4985 ,  H01L23/36 ,  H01L23/3736 ,  H01L2224/16225

摘要： Chip-on-film packages are provided. A chip-on-film package includes a film substrate having a first surface and a second surface opposite to each other, a semiconductor chip on the first surface, and a thermal deformation member adjacent to the second surface. The thermal deformation member has a construction that causes its shape to transform according to a temperature. Related devices and device assembles are also provided.

摘要翻译： 提供片上胶卷包装。 片上胶片包装包括具有彼此相对的第一表面和第二表面的膜基材，第一表面上的半导体芯片和与第二表面相邻的热变形部件。 热变形构件具有使其形状根据温度变形的结构。 还提供了相关的设备和设备组件。

公开(公告)号：US20130091348A1

公开(公告)日：2013-04-11

申请号：US13617619

申请日：2012-09-14

申请人： Heungkyu KWON ,  Jae Choon KIM ,  Eunseok CHO ,  Jichul KIM

发明人： Heungkyu KWON ,  Jae Choon KIM ,  Eunseok CHO ,  Jichul KIM

IPC分类号： G06F9/06

CPC分类号： G06F1/206 ,  G01J5/10 ,  G05B15/02

摘要： A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.

摘要翻译： 提供了移动设备的表面温度管理方法。 该方法包括在移动设备的操作模式中感测应用处理器的温度; 以及使用感测到的温度来控制应用处理器和表面温度管理表以管理移动设备的目标部分的表面温度。 表面温度管理表包括与操作模式中的目标部件的表面温度相对应的与应用处理器的温度有关的信息。

公开(公告)号：US20130057559A1

公开(公告)日：2013-03-07

申请号：US13596647

申请日：2012-08-28

申请人： Jichul KIM ,  Young-Deuk KIM ,  Eunseok CHO ,  Mi-Na CHOI

发明人： Jichul KIM ,  Young-Deuk KIM ,  Eunseok CHO ,  Mi-Na CHOI

IPC分类号： G06F13/00

CPC分类号： G06F13/00 ,  G09G3/3648 ,  G09G2300/0426

摘要： A display device includes a panel including pixels defined by data lines and gate lines, a housing chassis covering a sidewall and an edge of the panel, a printed circuit board under the panel, the printed circuit board including circuit elements configured to generate at least one of a data signal, a gate signal, and a control signal, a chip on film connecting the printed circuit board to the panel, the chip on film between the housing chassis and the sidewall of the panel, a driver integrated circuit mounted on the chip on film and configured to respond to the control signal and drive at least one of the data signal and the gate signal applied to the data lines and the gate lines, and a connection unit attaching the chip on film to the housing chassis and dissipating heat generated by the driver integrated circuit to the housing chassis.

摘要翻译： 显示装置包括包括由数据线和栅极线限定的像素的面板，覆盖面板的侧壁和边缘的壳体底板，面板下面的印刷电路板，印刷电路板包括被配置为产生至少一个 数据信号，门信号和控制信号，将印刷电路板连接到面板上的片上胶片，壳体底板和面板侧壁之间的芯片，安装在芯片上的驱动器集成电路 并且被配置为响应于控制信号并且驱动施加到数据线和栅极线的数据信号和栅极信号中的至少一个;以及连接单元，将膜上的芯片附接到壳体底座并且散发产生的热量 由驱动器集成电路到外壳底盘。

公开(公告)号：US20130021768A1

公开(公告)日：2013-01-24

申请号：US13535967

申请日：2012-06-28

申请人： Jichul KIM ,  Jae Choon KIM ,  Young-deuk KIM ,  Eunseok CHO

发明人： Jichul KIM ,  Jae Choon KIM ,  Young-deuk KIM ,  Eunseok CHO

IPC分类号： H01L23/495 ,  H05K7/04

CPC分类号： H01L23/4985 ,  H01L23/36 ,  H01L23/3736 ,  H01L2224/16225

摘要： Chip-on-film packages are provided. A chip-on-film package includes a film substrate having a first surface and a second surface opposite to each other, a semiconductor chip on the first surface, and a thermal deformation member adjacent to the second surface. The thermal deformation member has a construction that causes its shape to transform according to a temperature. Related devices and device assembles are also provided.

摘要翻译： 提供片上胶卷包装。 片上胶片包装包括具有彼此相对的第一表面和第二表面的膜基材，第一表面上的半导体芯片和与第二表面相邻的热变形部件。 热变形构件具有使其形状根据温度变形的结构。 还提供了相关的设备和设备组件。

公开(公告)号：US09978661B2

公开(公告)日：2018-05-22

申请号：US15235958

申请日：2016-08-12

申请人： Yunhyeok Im ,  Oleg Feygenson ,  Sang Il Kim ,  Youngbae Kim ,  Jichul Kim ,  Seungkon Mok ,  Jungsu Ha

发明人： Yunhyeok Im ,  Oleg Feygenson ,  Sang Il Kim ,  Youngbae Kim ,  Jichul Kim ,  Seungkon Mok ,  Jungsu Ha

IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L21/56 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10 ,  H01L25/00 ,  H01L29/06

CPC分类号： H01L23/367 ,  H01L21/4871 ,  H01L21/563 ,  H01L23/36 ,  H01L23/3736 ,  H01L23/49816 ,  H01L23/552 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

摘要： Semiconductor packages and methods of fabricating the same are disclosed. The semiconductor package may include a package substrate, a semiconductor chip, which is mounted on the package substrate to have a bottom surface facing the package substrate and a top surface opposite to the bottom surface, a mold layer provided on the package substrate to encapsulate the semiconductor chip, and a heat dissipation layer provided on the top surface of the semiconductor chip. The mold layer may have a top surface substantially coplanar with the top surface of the semiconductor chip, and the top surfaces of the semiconductor chip and the mold layer may have a difference in surface roughness from each other.

公开(公告)号：US20170229373A1

公开(公告)日：2017-08-10

申请号：US15495324

申请日：2017-04-24

申请人： JAE CHOON KIM ,  JICHUL KIM ,  Jin-Kwon BAE ,  EUNSEOK CHO

发明人： JAE CHOON KIM ,  JICHUL KIM ,  Jin-Kwon BAE ,  EUNSEOK CHO

IPC分类号： H01L23/38 ,  H01L25/10 ,  H01L25/18 ,  F25B21/02 ,  H01L35/32

CPC分类号： H01L23/38 ,  F25B21/02 ,  F25B2321/0212 ,  F25B2700/2107 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/18 ,  H01L35/32 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.

公开(公告)号：US09583430B2

公开(公告)日：2017-02-28

申请号：US14457094

申请日：2014-08-11

申请人： Kyol Park ,  Jichul Kim ,  Yunhyeok Im ,  Eon Soo Jang

发明人： Kyol Park ,  Jichul Kim ,  Yunhyeok Im ,  Eon Soo Jang

IPC分类号： H01L23/538 ,  H01L23/522 ,  H01L23/552 ,  H01L25/10 ,  H01L25/00 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H05K1/02 ,  H05K1/14 ,  H01L25/065 ,  H01L23/42 ,  H01L23/00

CPC分类号： H01L23/5226 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5385 ,  H01L23/552 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92225 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/0207 ,  H05K1/141 ,  H05K2201/10378 ,  H01L2924/00012 ,  H01L2924/00

摘要： The inventive concepts provide package-on-package (PoP) devices. In the PoP devices, an interposer substrate and a thermal boundary material layer may be disposed between a lower semiconductor package and an upper semiconductor package to rapidly exhaust heat generated from a lower semiconductor chip included in the lower semiconductor package. The interposer substrate may be formed of one or more insulating layers, conductive vias, heat dissipating members, protection layers, and various conductive patterns.

摘要翻译： 本发明的概念提供了封装封装（PoP）器件。 在PoP器件中，可以在下半导体封装和上半导体封装之间设置插入器衬底和热边界材料层，以快速排出由下半导体封装中包括的下半导体芯片产生的热。 插入器基板可以由一个或多个绝缘层，导电通孔，散热构件，保护层和各种导电图案形成。

公开(公告)号：US20110239382A1

公开(公告)日：2011-10-06

申请号：US13076909

申请日：2011-03-31

申请人： Jeihun LEE ,  Jeongsuk Yoon ,  Jongwon Park ,  Yun Keun Kwak ,  Jichul Kim ,  Donghoon Yi ,  Seungmin Baek

发明人： Jeihun LEE ,  Jeongsuk Yoon ,  Jongwon Park ,  Yun Keun Kwak ,  Jichul Kim ,  Donghoon Yi ,  Seungmin Baek

IPC分类号： B08B7/00

CPC分类号： A47L9/009 ,  A47L2201/00 ,  B60B19/12

摘要： A robot cleaner includes wheels mounted at a lower side of a main body of the robot cleaner to allow for traveling of the main body, and wire winding prevention members mounted at the lower side of the main body, each wire winding prevention member having one end extending to be contactable with a rim of the corresponding wheel. The wire winding prevention member is preferably a torsion spring.

摘要翻译： 机器人清洁器包括安装在机器人清洁器的主体的下侧的轮子，以允许主体的行进，以及安装在主体的下侧的防止卷绕的构件，每个绕线防止构件具有一端 延伸成与相应车轮的轮辋接触。 绕线防止构件优选为扭转弹簧。