发明申请
- 专利标题： Methods for Forming 3DIC Package
- 专利标题（中）： 形成3DIC包的方法
-
申请号： US13272032申请日： 2011-10-12
-
公开(公告)号： US20130095608A1公开(公告)日： 2013-04-18
- 发明人: Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
- 申请人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/00
摘要：
A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.
公开/授权文献
- US08609462B2 Methods for forming 3DIC package 公开/授权日：2013-12-17
信息查询
IPC分类:
