发明申请
- 专利标题： POWER MODULE PACKAGE
- 专利标题（中）： 电源模块封装
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申请号： US13610671申请日： 2012-09-11
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公开(公告)号： US20130105953A1公开(公告)日： 2013-05-02
- 发明人: Kwang Soo Kim , Yong Hoon Kwak , Sun Woo Yun , Young Ki Lee , Kyu Hwan Oh , Jin Suk Son
- 申请人： Kwang Soo Kim , Yong Hoon Kwak , Sun Woo Yun , Young Ki Lee , Kyu Hwan Oh , Jin Suk Son
- 申请人地址： KR Gyunggi-do
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Gyunggi-do
- 优先权： KR10-2011-0112335 20111031
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
Disclosed herein is a power module package including: a substrate having a ceramic layer formed in one surface thereof; a circuit pattern formed on the ceramic layer; a first lead frame having one side contacting the circuit pattern and the other side protruding toward the outside; and a first semiconductor chip mounted on one side of the first lead frame.
公开/授权文献
- US09105611B2 Power module package 公开/授权日：2015-08-11