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公开(公告)号:US20130105953A1
公开(公告)日:2013-05-02
申请号:US13610671
申请日:2012-09-11
申请人: Kwang Soo Kim , Yong Hoon Kwak , Sun Woo Yun , Young Ki Lee , Kyu Hwan Oh , Jin Suk Son
发明人: Kwang Soo Kim , Yong Hoon Kwak , Sun Woo Yun , Young Ki Lee , Kyu Hwan Oh , Jin Suk Son
IPC分类号: H01L23/495
CPC分类号: H01L23/4334 , H01L23/49531 , H01L23/49537 , H01L23/49575 , H01L2224/48137 , H01L2224/48247 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2924/00014
摘要: Disclosed herein is a power module package including: a substrate having a ceramic layer formed in one surface thereof; a circuit pattern formed on the ceramic layer; a first lead frame having one side contacting the circuit pattern and the other side protruding toward the outside; and a first semiconductor chip mounted on one side of the first lead frame.
摘要翻译: 本文公开了一种功率模块封装,包括:具有在其一个表面中形成的陶瓷层的基板; 形成在陶瓷层上的电路图案; 第一引线框架,其一侧接触电路图案,另一侧向外突出; 以及安装在所述第一引线框架的一侧上的第一半导体芯片。
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公开(公告)号:US20130010425A1
公开(公告)日:2013-01-10
申请号:US13280866
申请日:2011-10-25
申请人: Jin Suk SON , Kwang Soo KIM , Young Ki LEE , Sun Woo YUN , Sung Keun PARK
发明人: Jin Suk SON , Kwang Soo KIM , Young Ki LEE , Sun Woo YUN , Sung Keun PARK
CPC分类号: H01L23/473 , H01L23/4334 , H01L23/49575 , H01L24/73 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer.
摘要翻译: 这里公开了功率模块封装及其制造方法。 功率模块封装包括:由金属材料制成的基底; 形成为允许冷却材料在基底基板的内部部分流动的冷却通道; 阳极化层,形成在所述基底基板的外表面上; 金属层,其形成在具有阳极氧化层的基底基板的第一表面上,并且包括电路和连接焊盘; 以及安装在金属层上的半导体器件。
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公开(公告)号:US09105611B2
公开(公告)日:2015-08-11
申请号:US13610671
申请日:2012-09-11
申请人: Kwang Soo Kim , Yong Hoon Kwak , Sun Woo Yun , Young Ki Lee , Kyu Hwan Oh , Jin Suk Son
发明人: Kwang Soo Kim , Yong Hoon Kwak , Sun Woo Yun , Young Ki Lee , Kyu Hwan Oh , Jin Suk Son
IPC分类号: H01L23/495 , H01L23/433
CPC分类号: H01L23/4334 , H01L23/49531 , H01L23/49537 , H01L23/49575 , H01L2224/48137 , H01L2224/48247 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2924/00014
摘要: Disclosed herein is a power module package including: a substrate having a ceramic layer formed in one surface thereof; a circuit pattern formed on the ceramic layer; a first lead frame having one side contacting the circuit pattern and the other side protruding toward the outside; and a first semiconductor chip mounted on one side of the first lead frame.
摘要翻译: 本文公开了一种功率模块封装,包括:具有在其一个表面中形成的陶瓷层的基板; 形成在陶瓷层上的电路图案; 第一引线框架,其一侧接触电路图案,另一侧向外突出; 以及安装在所述第一引线框架的一侧上的第一半导体芯片。
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公开(公告)号:US08792239B2
公开(公告)日:2014-07-29
申请号:US13280866
申请日:2011-10-25
申请人: Jin Suk Son , Kwang Soo Kim , Young Ki Lee , Sun Woo Yun , Sung Keun Park
发明人: Jin Suk Son , Kwang Soo Kim , Young Ki Lee , Sun Woo Yun , Sung Keun Park
IPC分类号: H05K7/20
CPC分类号: H01L23/473 , H01L23/4334 , H01L23/49575 , H01L24/73 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer.
摘要翻译: 这里公开了功率模块封装及其制造方法。 功率模块封装包括:由金属材料制成的基底; 形成为允许冷却材料在基底基板的内部部分流动的冷却通道; 阳极化层,形成在所述基底基板的外表面上; 金属层,其形成在具有阳极氧化层的基底基板的第一表面上,并且包括电路和连接焊盘; 以及安装在金属层上的半导体器件。
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公开(公告)号:US20130020687A1
公开(公告)日:2013-01-24
申请号:US13301616
申请日:2011-11-21
申请人: Kwang Soo Kim , Young Ki Lee , Seog Moon Choi , Jin Suk Son
发明人: Kwang Soo Kim , Young Ki Lee , Seog Moon Choi , Jin Suk Son
IPC分类号: H01L23/495 , H01L21/56
CPC分类号: H01L21/50 , H01L21/565 , H01L23/24 , H01L23/3107 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L23/49586 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00012 , H01L2924/00
摘要: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.
摘要翻译: 这里公开了功率模块封装及其制造方法。 功率模块封装包括彼此相对设置的第一和第二引线框架; 形成在所述第一引线框架和所述第二引线框架中的两个或第二引线框架的第一表面的一部分上的陶瓷涂层; 以及安装在第一和第二引线框架的第二表面上的半导体器件。
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