发明申请
- 专利标题: LIGHT EMITTING DIODE AND FABRICATING METHOD THEREOF
- 专利标题(中): 发光二极管及其制造方法
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申请号: US13365217申请日: 2012-02-02
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公开(公告)号: US20130112987A1公开(公告)日: 2013-05-09
- 发明人: Yi-Keng Fu , Ren-Hao Jiang , Yen-Hsiang Fang , Bo-Chun Chen , Chia-Feng Lin
- 申请人: Yi-Keng Fu , Ren-Hao Jiang , Yen-Hsiang Fang , Bo-Chun Chen , Chia-Feng Lin
- 申请人地址: TW Hsinchu
- 专利权人: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人地址: TW Hsinchu
- 优先权: TW100140563 20111107
- 主分类号: H01L33/32
- IPC分类号: H01L33/32
摘要:
A light emitting diode including a GaN substrate, a first type semiconductor layer, a light emitting layer, a second type semiconductor layer, a first electrode, and a second electrode is provided. The GaN substrate has a first surface and a second surface opposite thereto, and the second surface has a plurality of protuberances, the height of the protuberance is h μm and the distribution density of the protuberance on the second surface is d cm−2, wherein 9.87×107≦h2d, and h≦1.8. The first type semiconductor is disposed on the first surface of the GaN substrate. The light emitting layer is disposed on a partial region of the first semiconductor layer, and the wavelength of the light emitted by the light emitting layer is from 375 nm to 415 nm. The second semiconductor layer is disposed on the light emitting layer.
公开/授权文献
- US08604488B2 Light emitting diode and fabricating method thereof 公开/授权日:2013-12-10
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