发明申请
- 专利标题： Bumps for Chip Scale Packaging
- 专利标题（中）： 用于芯片尺寸包装的冲击
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申请号： US13294859申请日： 2011-11-11
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公开(公告)号： US20130119532A1公开(公告)日： 2013-05-16
- 发明人: Chun-Hung Lin , Yu-Feng Chen , Tsung-Shu Lin , Han-Ping Pu , Hsien-Wei Chen
- 申请人： Chun-Hung Lin , Yu-Feng Chen , Tsung-Shu Lin , Han-Ping Pu , Hsien-Wei Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/485
- IPC分类号： H01L23/485
摘要：
A chip scale semiconductor device comprises a semiconductor die, a first bump and a second bump. The first bump having a first diameter and a first height is formed on an outer region of the semiconductor die. A second bump having a second diameter and a second height is formed on an inner region of the semiconductor die. The second diameter is greater than the first diameter while the second height is the same as the first height. By changing the shape of the bump, the stress and strain can be redistributed through the bump. As a result, the thermal cycling reliability of the chip scale semiconductor device is improved.
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