发明申请
- 专利标题： SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 半导体封装及其制造方法
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申请号： US13438483申请日： 2012-04-03
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公开(公告)号： US20130119553A1公开(公告)日： 2013-05-16
- 发明人: Tae Sung JEONG , Jung Soo BYUN , Yul Kyo CHUNG , Doo Hwan LEE
- 申请人： Tae Sung JEONG , Jung Soo BYUN , Yul Kyo CHUNG , Doo Hwan LEE
- 专利权人： SAMSUNG Electro-Mechanics Co., Ltd.
- 当前专利权人： SAMSUNG Electro-Mechanics Co., Ltd.
- 优先权： KR10-2011-0117018 20111110
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/78
摘要：
Disclosed herein is a semiconductor package including an electrical device having a first lateral surface; and a core substrate including a cavity in which the electrical device is positioned, wherein the core substrate is inclined in a thickness direction of the core substrate and has a second lateral surface that defines the cavity.