公开(公告)号：US08547132B2

公开(公告)日：2013-10-01

申请号：US12870347

申请日：2010-08-27

申请人： Hyun Ho Kim ,  Won Geun Jung ,  Yul Kyo Chung

发明人： Hyun Ho Kim ,  Won Geun Jung ,  Yul Kyo Chung

IPC分类号： G01R31/28

CPC分类号： G01R31/2818 ,  G01R31/2812 ,  H05K1/0268 ,  H05K1/185 ,  H05K2203/162

摘要： A circuit board includes an active device, a signal pad on a surface of the circuit board, at least one passive device electrically connecting the active device to the signal pad, and at least one test pad on the surface of the circuit board and electrically connected to a connection point between the active device and the at least one passive device. When a first passive device and a second passive device and a first test pad and a second test pad are provided, the first passive device and the second passive device are connected in series between the active device and the signal pad in this order, the first test pad is connected to a connection point between the active device and the first passive device, and the second test pad is connected to a connection point between the first passive device and the second passive device.

摘要翻译： 电路板包括有源器件，电路板表面上的信号焊盘，至少一个将有源器件电连接到信号焊盘的无源器件，以及电路板表面上的至少一个测试焊盘，并电连接 到活动设备和至少一个无源设备之间的连接点。 当提供第一无源器件和第二无源器件以及第一测试焊盘和第二测试焊盘时，第一无源器件和第二无源器件依次连接在有源器件和信号焊盘之间，第一无源器件 测试垫连接到有源器件和第一无源器件之间的连接点，第二测试焊盘连接到第一无源器件和第二无源器件之间的连接点。

公开(公告)号：US20130119553A1

公开(公告)日：2013-05-16

申请号：US13438483

申请日：2012-04-03

申请人： Tae Sung JEONG ,  Jung Soo BYUN ,  Yul Kyo CHUNG ,  Doo Hwan LEE

发明人： Tae Sung JEONG ,  Jung Soo BYUN ,  Yul Kyo CHUNG ,  Doo Hwan LEE

IPC分类号： H01L23/498 ,  H01L21/78

CPC分类号： H01L29/0657 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/21 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2924/10155 ,  H01L2924/12042 ,  H01L2924/15156 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09827 ,  H01L2924/00

摘要： Disclosed herein is a semiconductor package including an electrical device having a first lateral surface; and a core substrate including a cavity in which the electrical device is positioned, wherein the core substrate is inclined in a thickness direction of the core substrate and has a second lateral surface that defines the cavity.

摘要翻译： 本文公开了一种半导体封装，其包括具有第一侧表面的电气装置; 以及包括其中定位所述电气装置的空腔的芯基板，其中所述芯基板在所述芯基板的厚度方向上倾斜并且具有限定所述空腔的第二侧表面。

公开(公告)号：US08064215B2

公开(公告)日：2011-11-22

申请号：US12230872

申请日：2008-09-05

申请人： Yul-Kyo Chung ,  Sung Yi ,  Soon-Gyu Yim ,  Seog-Moon Choi ,  Jin-Gu Kim ,  Young-Do Kweon

发明人： Yul-Kyo Chung ,  Sung Yi ,  Soon-Gyu Yim ,  Seog-Moon Choi ,  Jin-Gu Kim ,  Young-Do Kweon

IPC分类号： H05K1/18

CPC分类号： H05K1/162 ,  H01L23/3114 ,  H01L23/50 ,  H01L23/5389 ,  H01L23/642 ,  H01L24/25 ,  H01L2224/05001 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/2518 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19015 ,  H01L2924/19041 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09763 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor chip package and a printed circuit board having an embedded semiconductor chip package are disclosed. The semiconductor chip package may include a semiconductor chip that has at least one chip pad formed on one side, and a capacitor formed on the other side of the semiconductor chip.

摘要翻译： 公开了一种半导体芯片封装和具有嵌入式半导体芯片封装的印刷电路板。 半导体芯片封装可以包括在一侧形成有至少一个芯片焊盘的半导体芯片和形成在半导体芯片的另一侧上的电容器。

公开(公告)号：US07943858B2

公开(公告)日：2011-05-17

申请号：US12076989

申请日：2008-03-26

申请人： Seung Eun Lee ,  Yul Kyo Chung ,  Jung Won Lee ,  In Hyung Lee ,  Byung Ik Song

发明人： Seung Eun Lee ,  Yul Kyo Chung ,  Jung Won Lee ,  In Hyung Lee ,  Byung Ik Song

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H01G4/105 ,  H01G4/33 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/435

摘要： There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal oxide is adjusted in content to attain a desired dielectric constant. Also, another dielectric layer having a different content of metallic phase bismuth may be formed. The thin film capacitor including: a first electrode; a dielectric layer including a first dielectric film formed on the first electrode, the dielectric layer comprising a BiZnNb-based amorphous metal oxide; and a second electrode formed on the dielectric layer, wherein the BiZnNb-based amorphous metal oxide contains metallic phase bismuth.

摘要翻译： 提供了薄膜电容器和电容器嵌入式印刷电路板，改善了漏电流特性。 电介质层由具有预定介电常数的BiZnNb基非晶态金属氧化物形成，而不在高温下进行热处理，并且将BiZnNb基非晶态金属氧化物的金属相铋的含量调节到所需的介电常数。 此外，可以形成具有不同金属相铋含量的另一介质层。 所述薄膜电容器包括：第一电极; 介电层，包括形成在所述第一电极上的第一电介质膜，所述电介质层包含BiZnNb基非晶态金属氧化物; 以及形成在所述电介质层上的第二电极，其中所述BiZnNb基非晶态金属氧化物含有金属相铋。

公开(公告)号：US20110048780A1

公开(公告)日：2011-03-03

申请号：US12860301

申请日：2010-08-20

申请人： Jin-Soo Jeong ,  Doo-hwan Lee ,  Hwa-Sun Park ,  Jae-Kul Lee ,  Yul-Kyo Chung

发明人： Jin-Soo Jeong ,  Doo-hwan Lee ,  Hwa-Sun Park ,  Jae-Kul Lee ,  Yul-Kyo Chung

IPC分类号： H05K1/16 ,  H05K3/10

CPC分类号： H05K3/007 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/0554 ,  H05K2203/1572 ,  Y10T29/49124 ,  H01L2924/00

摘要： A method of processing a cavity of a core substrate is disclosed. The method of processing a cavity of a core substrate in accordance with an embodiment of the present invention can include: forming a first processing area on one surface of a core substrate, the first processing area being demarcated by a circuit pattern; forming a second processing area on the other surface of the core substrate, the second processing area being demarcated by a circuit pattern; and processing a cavity by removing the entire first processing area from the one surface of the core substrate.

摘要翻译： 公开了一种处理芯基板的空腔的方法。 根据本发明的实施例的处理芯基板的空腔的方法可以包括：在芯基板的一个表面上形成第一处理区域，第一处理区域由电路图案划定; 在所述芯基板的另一表面上形成第二处理区域，所述第二处理区域由电路图案划定; 以及通过从芯基板的一个表面去除整个第一处理区域来处理空腔。

公开(公告)号：US07886436B2

公开(公告)日：2011-02-15

申请号：US12370818

申请日：2009-02-13

申请人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

发明人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

IPC分类号： H05K3/10

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/417 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; and a method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

摘要翻译： 这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。 具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。

公开(公告)号：US07737529B2

公开(公告)日：2010-06-15

申请号：US11582954

申请日：2006-10-19

申请人： Jin Seok Moon ,  Seung Eun Lee ,  Hyung Mi Jung ,  Yul Kyo Chung ,  Seung Hyun Sohn

发明人： Jin Seok Moon ,  Seung Eun Lee ,  Hyung Mi Jung ,  Yul Kyo Chung ,  Seung Hyun Sohn

IPC分类号： H01L29/00

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179

摘要： The invention provides a PCB with a thin film capacitor embedded therein and a method for manufacturing the same. The PCB includes a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode via low temperature film formation; a buffer layer formed on the amorphous paraelectric film; a metal seed layer formed on the buffer layer; and an upper electrode formed on the metal seed layer.

摘要翻译： 本发明提供一种其中嵌有薄膜电容器的PCB及其制造方法。 PCB包括形成在绝缘基板上的下电极; 通过低温成膜形成在下电极上的非晶顺电膜; 形成在所述非晶正电介质膜上的缓冲层; 形成在缓冲层上的金属种子层; 以及形成在金属籽晶层上的上电极。

公开(公告)号：US07730612B2

公开(公告)日：2010-06-08

申请号：US12081858

申请日：2008-04-22

申请人： Hwa-Sun Park ,  Sung Yi ,  Sang-Chul Lee ,  Jong-Woon Kim ,  Yul-Kyo Chung

发明人： Hwa-Sun Park ,  Sung Yi ,  Sang-Chul Lee ,  Jong-Woon Kim ,  Yul-Kyo Chung

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H05K1/056 ,  H05K3/445 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0969 ,  H05K2203/1469 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139

摘要： A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first metal layer stacked over a first insulation layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.

摘要翻译： 公开了一种制造嵌入元件的印刷电路板的方法。 该方法包括：在第一绝缘层上形成盲孔以使第一绝缘层被暴露，对于包覆层叠在第一绝缘层上的第一金属层的覆金属层压板，将部件固定在第一绝缘层上 将所述部件嵌入所述盲孔中，在所述覆金属层压板的任一侧堆叠第二绝缘层和第二金属层，以及通过去除所述金属层的一部分来形成电路图案。

公开(公告)号：US07675756B2

公开(公告)日：2010-03-09

申请号：US11593088

申请日：2006-11-06

申请人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

发明人： Jin Seok Moon ,  Yul Kyo Chung ,  Soo Hyun Lyoo ,  Seung Hyun Sohn

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  Y10T29/417 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board with an embedded thin-film capacitor, and a method of manufacturing the same.Specifically, the present invention relates to a printed circuit board with an embedded thin-film capacitor, comprising a lower electrode formed on an insulating substrate; an amorphous paraelectric film formed on the lower electrode; a metal seed layer formed on the paraelectric film; and an upper electrode formed on the metal seed layer and having a surface roughness (Ra) of more than 300 nm; anda method of manufacturing a printed circuit board with an embedded thin-film capacitor, comprising forming a lower electrode on an insulating substrate; forming an amorphous paraelectric film on the lower electrode, using a low-temperature film formation process; forming a metal seed layer on the paraelectric film; and forming an upper electrode having a surface roughness (Ra) of more than 300 nm on the metal seed layer, using an electroplating method.

摘要翻译： 这里公开了具有嵌入式薄膜电容器的印刷电路板及其制造方法。 具体地说，本发明涉及一种具有嵌入式薄膜电容器的印刷电路板，包括形成在绝缘基板上的下电极; 形成在下电极上的非晶顺电膜; 形成在顺电膜上的金属种子层; 和形成在金属籽晶层上并具有大于300nm的表面粗糙度（Ra）的上电极; 以及制造具有嵌入式薄膜电容器的印刷电路板的方法，包括在绝缘基板上形成下电极; 使用低温成膜法在下电极上形成非晶顺电膜; 在顺电膜上形成金属种子层; 并且使用电镀方法在金属籽晶层上形成表面粗糙度（Ra）大于300nm的上电极。

公开(公告)号：US20090301766A1

公开(公告)日：2009-12-10

申请号：US12219441

申请日：2008-07-22

申请人： Hwa Sun Park ,  Yul Kyo Chung ,  Jin Won Lee ,  Jin Soo Jeong

发明人： Hwa Sun Park ,  Yul Kyo Chung ,  Jin Won Lee ,  Jin Soo Jeong

IPC分类号： H05K1/03 ,  H01R43/00

CPC分类号： H05K1/185 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K3/4602 ,  H05K2201/0394 ,  H05K2201/10674 ,  H05K2201/10969 ,  Y10T29/49171

摘要： Disclosed herein is a printed circuit board including an electronic component embedded therein, as the electronic component is supported on the metal layer of core substrate, thus supporting and radiation performances are improved, production costs are reduced, and the manufacturing process is simplified.

摘要翻译： 这里公开了包括嵌入其中的电子部件的印刷电路板，由于电子部件被支撑在芯基板的金属层上，因此支撑和辐射性能得到改善，生产成本降低，并且制造过程简化。