发明申请
- 专利标题： Light-Emitting Diode (LED) Package Systems
- 专利标题（中）： 发光二极管（LED）封装系统
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申请号： US13767994申请日： 2013-02-15
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公开(公告)号： US20130157395A1公开(公告)日： 2013-06-20
- 发明人: Chung Yu Wang
- 申请人： TSMC Solid State Lighting Ltd.
- 申请人地址： TW HsinChu
- 专利权人： TSMC Solid State Lighting Ltd.
- 当前专利权人： TSMC Solid State Lighting Ltd.
- 当前专利权人地址： TW HsinChu
- 主分类号： H01L33/64
- IPC分类号： H01L33/64
摘要：
A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure.
公开/授权文献
- US08628984B2 Light-emitting diode (LED) package systems 公开/授权日：2014-01-14
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