Invention Application
- Patent Title: HIGH THERMALLY CONDUCTIVE COMPOSITES
- Patent Title (中): 高导热复合材料
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Application No.: US13467976Application Date: 2012-05-09
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Publication No.: US20130164510A1Publication Date: 2013-06-27
- Inventor: Chien-Ming CHEN , Yao-Chu CHUNG , Fu-Ming CHIEN , Chun-Hsiung LIAO , Chih-Jen CHANG , Chin-Lang WU , Tien-Jung HUANG , Cheng-Chou WONG , Chih-Chung CHANG
- Applicant: Chien-Ming CHEN , Yao-Chu CHUNG , Fu-Ming CHIEN , Chun-Hsiung LIAO , Chih-Jen CHANG , Chin-Lang WU , Tien-Jung HUANG , Cheng-Chou WONG , Chih-Chung CHANG
- Applicant Address: TW HSINCHU
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW HSINCHU
- Priority: TWTW100147696 20111221
- Main IPC: B32B7/02
- IPC: B32B7/02 ; C09K5/00 ; B82Y30/00

Abstract:
Disclosed is a high thermally conductive composite, including a first composite and a second composite having a co-continuous and incompatible dual-phase manner. The first composite consists of glass fiber distributed into polyphenylene sulfide, and the second composite consists of carbon material distributed into polyethylene terephthalate. The carbon material includes graphite, graphene, carbon fiber, carbon nanotube, or combinations thereof.
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