Invention Application
US20130171350A1 High Throughput Processing Using Metal Organic Chemical Vapor Deposition
审中-公开
使用金属有机化学气相沉积的高通量处理
- Patent Title: High Throughput Processing Using Metal Organic Chemical Vapor Deposition
- Patent Title (中): 使用金属有机化学气相沉积的高通量处理
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Application No.: US13339563Application Date: 2011-12-29
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Publication No.: US20130171350A1Publication Date: 2013-07-04
- Inventor: Philip A. Kraus , Tony P. Chiang , Timothy Joseph Franklin , Chi-I Lang , Sandeep Nijhawan
- Applicant: Philip A. Kraus , Tony P. Chiang , Timothy Joseph Franklin , Chi-I Lang , Sandeep Nijhawan
- Applicant Address: US CA San Jose
- Assignee: Intermolecular Inc.
- Current Assignee: Intermolecular Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: C23C16/44
- IPC: C23C16/44 ; B05C11/00

Abstract:
A metal-organic chemical vapor deposition (MOCVD) system is provided for high throughput processing. The system comprises a chamber containing a substrate support system comprising a plurality of substrate support planets operable to support one or more substrates, and a gas emission system operable to provide a plurality of isolated environments suitable for depositing uniform layers on the substrates. The MOCVD system is operable to independently vary one or more process parameters in each isolated environment, and to provide common process parameters to all substrates for depositing one or more layers on all substrates. Methods of forming uniform layers on a substrate are provided wherein at least one of the layers is deposited in an isolated environment.
Information query
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