发明申请
- 专利标题: CORRECTION FOR FLARE EFFECTS IN LITHOGRAPHY SYSTEM
- 专利标题(中): 校正系统中的FLASH效应的校正
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申请号: US13823685申请日: 2011-09-01
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公开(公告)号: US20130185681A1公开(公告)日: 2013-07-18
- 发明人: Hua-Yu Liu , Jiangwei Li , Luoqi Chen , Wei Liu , Jiong Jiang
- 申请人: Hua-Yu Liu , Jiangwei Li , Luoqi Chen , Wei Liu , Jiong Jiang
- 申请人地址: NL Veldhoven
- 专利权人: ASML NETHERLANDS B.V.
- 当前专利权人: ASML NETHERLANDS B.V.
- 当前专利权人地址: NL Veldhoven
- 国际申请: PCT/EP2011/064390 WO 20110901
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
A method for reducing an effect of flare produced by a lithographic apparatus for imaging a design layout onto a substrate is described. A flare map in an exposure field of the lithographic apparatus is simulated by mathematically combining a density map of the design layout at the exposure field with a point spread function (PSF), wherein system-specific effects on the flare map may be incorporated in the simulation. Location-dependent flare corrections for the design layout are calculated by using the determined flare map, thereby reducing the effect of flare. Some of the system-specific effects included in the simulation are: a flare effect due to reflection from black border of a mask, a flare effect due to reflection from one or more reticle-masking blades defining an exposure slit, a flare effect due to overscan, a flare effect due reflections from a gas-lock sub-aperture of a dynamic gas lock (DGL) mechanism, and a flare effect due to contribution from neighboring exposure fields.
公开/授权文献
- US08887104B2 Correction for flare effects in lithography system 公开/授权日:2014-11-11
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