发明申请
- 专利标题： PAD AND CIRCUIT LAYOUT FOR SEMICONDUCTOR DEVICES
- 专利标题（中）： 半导体器件的PAD和电路布局
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申请号： US13398364申请日： 2012-02-16
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公开(公告)号： US20130214375A1公开(公告)日： 2013-08-22
- 发明人: Tiejun Dai , Kuei Chen Liang
- 申请人： Tiejun Dai , Kuei Chen Liang
- 申请人地址： US CA Santa Clara
- 专利权人： OMNIVISION TECHNOLOGIES, INC.
- 当前专利权人： OMNIVISION TECHNOLOGIES, INC.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L31/0224
- IPC分类号： H01L31/0224 ; H01L31/18 ; H01L23/488
摘要：
An apparatus includes an image sensor with a frontside and a backside. The image sensor includes an active circuit region and bonding pads. The active circuit region has a first shape that is substantially rectangular. The substantially rectangular first shape has first chamfered corners. A perimeter of the frontside of the image sensor has a second shape that is substantially rectangular. The second substantially rectangular shape has second chamfered corners. The bonding pads are disposed on the frontside of the image sensor. The bonding pads are disposed between the first chamfered corners and the second chamfered corners. The first shape is disposed inside the second shape.
公开/授权文献
- US08916980B2 Pad and circuit layout for semiconductor devices 公开/授权日：2014-12-23
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