公开(公告)号：US08933544B2

公开(公告)日：2015-01-13

申请号：US13547997

申请日：2012-07-12

申请人： Duli Mao ,  Hsin-Chih Tai ,  Yin Qian ,  Tiejun Dai ,  Howard E. Rhodes ,  Hongli Yang

发明人： Duli Mao ,  Hsin-Chih Tai ,  Yin Qian ,  Tiejun Dai ,  Howard E. Rhodes ,  Hongli Yang

IPC分类号： H01L23/552 ,  H01L27/146

CPC分类号： H01L27/14623 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/1469

摘要： An integrated circuit system includes a first device wafer having a first semiconductor layer proximate to a first metal layer including a first conductor disposed within a first metal layer oxide. A second device wafer having a second semiconductor layer proximate to a second metal layer including a second conductor is disposed within a second metal layer oxide. A frontside of the first device wafer is bonded to a frontside of the second device wafer at a bonding interface. A conductive path couples the first conductor to the second conductor through the bonding interface. A first metal EMI shield is disposed in one of the first metal oxide layer and second metal layer oxide layer. The first EMI shield is included in a metal layer of said one of the first metal oxide layer and the second metal layer oxide layer nearest to the bonding interface.

摘要翻译： 集成电路系统包括具有靠近第一金属层的第一半导体层的第一器件晶片，第一金属层包括设置在第一金属层氧化物内的第一导体。 具有靠近包括第二导体的第二金属层的第二半导体层的第二器件晶片设置在第二金属层氧化物内。 第一器件晶片的前端在接合界面处结合到第二器件晶片的前侧。 导电路径通过接合界面将第一导体耦合到第二导体。 第一金属EMI屏蔽设置在第一金属氧化物层和第二金属层氧化物层之一中。 第一EMI屏蔽包括在最靠近接合界面的第一金属氧化物层和第二金属层氧化物层中的所述一个的金属层中。

公开(公告)号：US08916980B2

公开(公告)日：2014-12-23

申请号：US13398364

申请日：2012-02-16

申请人： Tiejun Dai ,  Kuei Chen Liang

发明人： Tiejun Dai ,  Kuei Chen Liang

IPC分类号： H01L23/48

CPC分类号： H01L27/14618 ,  H01L27/14632 ,  H01L2224/13

摘要： An apparatus includes an image sensor with a frontside and a backside. The image sensor includes an active circuit region and bonding pads. The active circuit region has a first shape that is substantially rectangular. The substantially rectangular first shape has first chamfered corners. A perimeter of the frontside of the image sensor has a second shape that is substantially rectangular. The second substantially rectangular shape has second chamfered corners. The bonding pads are disposed on the frontside of the image sensor. The bonding pads are disposed between the first chamfered corners and the second chamfered corners. The first shape is disposed inside the second shape.

摘要翻译： 一种装置包括具有前侧和后侧的图像传感器。 图像传感器包括有源电路区域和接合焊盘。 有源电路区域具有大致矩形的第一形状。 大致矩形的第一形状具有第一倒角。 图像传感器的前侧的周边具有大致矩形的第二形状。 第二基本矩形形状具有第二倒角。 接合焊盘设置在图像传感器的前侧。 接合焊盘设置在第一倒角和第二倒角之间。 第一形状设置在第二形状的内部。

公开(公告)号：US20130264465A1

公开(公告)日：2013-10-10

申请号：US13440833

申请日：2012-04-05

申请人： Tiejun Dai ,  Junzhao Lei

发明人： Tiejun Dai ,  Junzhao Lei

IPC分类号： H01L27/146

CPC分类号： H04N5/335 ,  H01L27/14601 ,  H04N5/23241 ,  H04N5/369 ,  H04N5/378

摘要： An example image sensor system includes an image sensor having a first terminal and a host controller coupled to the first terminal. Logic is included in the image sensor system, that when executed transfers analog image data from the image sensor to the host controller through the first terminal of the image sensor and also transfers one or more digital control signals between the image sensor and the host controller through the same first terminal.

摘要翻译： 示例性图像传感器系统包括具有耦合到第一终端的第一终端和主机控制器的图像传感器。 逻辑包括在图像传感器系统中，当执行时，通过图像传感器的第一端将模拟图像数据从图像传感器传送到主机控制器，并且还通过图像传感器和主机控制器之间传送一个或多个数字控制信号 相同的第一个终端。

公开(公告)号：US20130214375A1

公开(公告)日：2013-08-22

申请号：US13398364

申请日：2012-02-16

申请人： Tiejun Dai ,  Kuei Chen Liang

发明人： Tiejun Dai ,  Kuei Chen Liang

IPC分类号： H01L31/0224 ,  H01L31/18 ,  H01L23/488

CPC分类号： H01L27/14618 ,  H01L27/14632 ,  H01L2224/13

摘要： An apparatus includes an image sensor with a frontside and a backside. The image sensor includes an active circuit region and bonding pads. The active circuit region has a first shape that is substantially rectangular. The substantially rectangular first shape has first chamfered corners. A perimeter of the frontside of the image sensor has a second shape that is substantially rectangular. The second substantially rectangular shape has second chamfered corners. The bonding pads are disposed on the frontside of the image sensor. The bonding pads are disposed between the first chamfered corners and the second chamfered corners. The first shape is disposed inside the second shape.

摘要翻译： 一种装置包括具有前侧和后侧的图像传感器。 图像传感器包括有源电路区域和接合焊盘。 有源电路区域具有大致矩形的第一形状。 大致矩形的第一形状具有第一倒角。 图像传感器的前侧的周边具有大致矩形的第二形状。 第二基本矩形形状具有第二倒角。 接合焊盘设置在图像传感器的前侧。 接合焊盘设置在第一倒角和第二倒角之间。 第一形状设置在第二形状的内部。

公开(公告)号：US20130187027A1

公开(公告)日：2013-07-25

申请号：US13355165

申请日：2012-01-20

申请人： Wenhao Qiao ,  Zheng Yang ,  Tiejun Dai

发明人： Wenhao Qiao ,  Zheng Yang ,  Tiejun Dai

IPC分类号： H01L27/146

CPC分类号： H04N5/2351 ,  H04N5/351 ,  H04N5/3741 ,  H04N5/378

摘要： An image sensor having an image acquisition mode and an ambient light sensing mode includes a pixel array having pixel cells organized into rows and columns for capturing image data and ambient light data. Readout circuitry is coupled via column bit lines to the pixels cells to read out the image data along the column bit lines. An ambient light detection (“ALD”) unit is selectively coupled to the pixel array to readout the ambient light data and to generate an ambient light signal based on ambient light incident upon the pixel array. Control circuitry is coupled to the pixel array to control time sharing of the pixels cells between the readout circuitry during image acquisition and the ALD unit during ambient light sensing.

摘要翻译： 具有图像获取模式和环境光感测模式的图像传感器包括具有被组织成用于捕获图像数据和环境光数据的行和列的像素单元的像素阵列。 读出电路通过列位线耦合到像素单元，以沿列位线读出图像数据。 环境光检测（“ALD”）单元选择性地耦合到像素阵列以读出环境光数据，并且基于入射到像素阵列上的环境光产生环境光信号。 控制电路耦合到像素阵列，以在环境光感测期间控制图像采集期间的读出电路与ALD单元之间的像素单元的时间共享。

公开(公告)号：US20120120300A1

公开(公告)日：2012-05-17

申请号：US12946689

申请日：2010-11-15

申请人： Tiejun Dai

发明人： Tiejun Dai

IPC分类号： H04N5/225 ,  H01L27/146

CPC分类号： H04N5/3745 ,  H04N5/3577 ,  H04N5/359 ,  H04N5/376

摘要： An apparatus of one aspect includes an array of pixels. Each of the pixels includes a photosensitive element and a transfer transistor coupled with the photosensitive element. Each of the transfer transistors has a transfer gate. The apparatus also includes a first transfer gate off voltage supply conductor and a second transfer gate off voltage supply conductor. A circuit is coupled with the first and second transfer gate off voltage supply conductors. The circuit is operable to couple the first transfer gate off voltage supply conductor to transfer gates of a first subset of the pixels of the array. The circuit is also operable to concurrently couple the second transfer gate off voltage supply conductor to transfer gates of a second subset of the pixels of the array.

摘要翻译： 一个方面的装置包括像素阵列。 每个像素包括光敏元件和与感光元件耦合的转移晶体管。 每个转移晶体管具有传输门。 该装置还包括第一传输栅极截止电压供应导体和第二传输栅极截止电压供应导体。 电路与第一和第二传输栅极截止电压供应导体耦合。 电路可操作以将第一传输栅极截止电压供应导体耦合到阵列的像素的第一子集的传输门。 电路还可操作以同时将第二传输栅极关断电压导体耦合到阵列的像素的第二子集的传输门。

公开(公告)号：US07995124B2

公开(公告)日：2011-08-09

申请号：US11856014

申请日：2007-09-14

申请人： Tiejun Dai

发明人： Tiejun Dai

IPC分类号： H04N5/335 ,  H03M1/20

CPC分类号： H04N5/235 ,  H04N5/2355 ,  H04N5/355

摘要： An image sensor apparatus comprises an image sensor for generating digital images having a high dynamic range. The image sensor apparatus includes an image sensor for generating a first and a second set of digital image samples at a first bit depth, with each set of digital image samples generated by a different column readout circuit path. A processor combines the first and second set of digital image samples to generate a digital image at a second bit depth, the second bit depth higher than the first bit depth.

摘要翻译： 图像传感器装置包括用于产生具有高动态范围的数字图像的图像传感器。 图像传感器装置包括图像传感器，用于以第一位深度产生第一和第二组数字图像样本，每一组数字图像样本由不同的列读出电路路径生成。 处理器组合第一和第二组数字图像采样以在第二位深度处产生数字图像，第二位深度高于第一位深度。

公开(公告)号：US08810670B2

公开(公告)日：2014-08-19

申请号：US13440846

申请日：2012-04-05

申请人： Tiejun Dai ,  Junzhao Lei

发明人： Tiejun Dai ,  Junzhao Lei

IPC分类号： H04N5/232

CPC分类号： H01L27/14601 ,  H04N5/335 ,  H04N5/369 ,  H04N5/3741 ,  H04N5/378

摘要： An example image sensor system includes an image sensor having a first terminal and a host controller coupled to the first terminal. Logic is included in the image sensor system, that when executed transfers clock signals from the host controller to the image sensor through the first terminal of the image sensor and also transfers one or more digital control signals between the image sensor and the host controller through the same first terminal.

摘要翻译： 示例性图像传感器系统包括具有耦合到第一终端的第一终端和主机控制器的图像传感器。 逻辑包括在图像传感器系统中，当执行时，通过图像传感器的第一端将时钟信号从主机控制器传送到图像传感器，并且还通过图像传感器和主机控制器之间传送一个或多个数字控制信号 相同的第一个终端。

公开(公告)号：US20130264688A1

公开(公告)日：2013-10-10

申请号：US13441627

申请日：2012-04-06

申请人： Yin Qian ,  Hsin-Chih Tai ,  Duli Mao ,  Tiejun Dai ,  Howard E. Rhodes ,  Hongli Yang

发明人： Yin Qian ,  Hsin-Chih Tai ,  Duli Mao ,  Tiejun Dai ,  Howard E. Rhodes ,  Hongli Yang

IPC分类号： H01L29/06 ,  H01L21/28

CPC分类号： H01L24/80 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L27/14634 ,  H01L2224/04042 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/08145 ,  H01L2224/2401 ,  H01L2224/24105 ,  H01L2224/24147 ,  H01L2224/48151 ,  H01L2224/73251 ,  H01L2224/80357 ,  H01L2224/80896 ,  H01L2224/80986 ,  H01L2224/82031 ,  H01L2224/82106 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06544 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3511 ,  H01L2224/80001 ,  H01L2924/00012 ,  H01L2224/05552

摘要： An integrated circuit system includes a first device wafer that has a first semiconductor layer proximate to a first metal layer including a first conductor disposed within a first metal layer oxide. A second device wafer that has a second semiconductor layer proximate to a second metal layer including a second conductor disposed within a second metal layer oxide is also included. A frontside of the first metal layer oxide is bonded to a frontside of the second metal layer oxide at an oxide bonding interface between the first metal layer oxide and the second metal layer oxide. A conductive path couples the first conductor to the second conductor with conductive material formed in a cavity etched between the first conductor and the second conductor and etched through the oxide bonding interface and through the second semiconductor layer from a backside of the second device wafer.

摘要翻译： 集成电路系统包括具有靠近第一金属层的第一半导体层的第一器件晶片，第一金属层包括设置在第一金属层氧化物内的第一导体。 还包括具有靠近第二金属层的第二半导体层的第二器件晶片，该第二金属层包括设置在第二金属层氧化物内的第二导体。 在第一金属层氧化物和第二金属层氧化物之间的氧化物接合界面处，第一金属层氧化物的前侧结合到第二金属层氧化物的前侧。 导电路径将第一导体耦合到第二导体，导电材料形成在蚀刻在第一导体和第二导体之间的空腔中，并通过氧化物接合界面从第二器件晶片的背面蚀刻穿过第二半导体层。

公开(公告)号：US20130264466A1

公开(公告)日：2013-10-10

申请号：US13440846

申请日：2012-04-05

申请人： Tiejun Dai ,  Junzhao Lei

发明人： Tiejun Dai ,  Junzhao Lei

IPC分类号： H01L27/146

CPC分类号： H01L27/14601 ,  H04N5/335 ,  H04N5/369 ,  H04N5/3741 ,  H04N5/378

摘要： An example image sensor system includes an image sensor having a first terminal and a host controller coupled to the first terminal. Logic is included in the image sensor system, that when executed transfers clock signals from the host controller to the image sensor through the first terminal of the image sensor and also transfers one or more digital control signals between the image sensor and the host controller through the same first terminal.

摘要翻译： 示例性图像传感器系统包括具有耦合到第一终端的第一终端和主机控制器的图像传感器。 逻辑包括在图像传感器系统中，当执行时，通过图像传感器的第一端将时钟信号从主机控制器传送到图像传感器，并且还通过图像传感器和主机控制器之间传送一个或多个数字控制信号 相同的第一个终端。