Invention Application
US20130216948A1 RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN-FORMING METHOD
有权
辐射敏感性树脂组合物和图案形成方法
- Patent Title: RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN-FORMING METHOD
- Patent Title (中): 辐射敏感性树脂组合物和图案形成方法
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Application No.: US13851158Application Date: 2013-03-27
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Publication No.: US20130216948A1Publication Date: 2013-08-22
- Inventor: Kazuki KASAHARA , Hiromitsu NAKASHIMA , Masafumi HORI , Masafumi YOSHIDA
- Applicant: JSR CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSR CORPORATION
- Current Assignee: JSR CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2010-220071 20100929
- Main IPC: G03F7/004
- IPC: G03F7/004

Abstract:
A radiation-sensitive resin composition for forming a resist film includes a polymer including a first structural unit represented by a formula (1) and a second structural unit represented by a formula (2). The first structural unit and the second structural unit are included in an identical polymer molecule or different polymer molecules. R1 represents a hydrogen atom or a methyl group. Q represents a divalent linking group having 1 to 4 carbon atoms. X represents a monovalent lactone group. A part or all of hydrogen atoms included in the monovalent lactone group represented by X are not substituted or substituted. R2 represents a hydrogen atom or a methyl group. Y represents a monovalent lactone group. A part or all of hydrogen atoms included in the monovalent lactone group represented by Y are not substituted or substituted.
Public/Granted literature
- US09158196B2 Radiation-sensitive resin composition and pattern-forming method Public/Granted day:2015-10-13
Information query
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