Abstract:
A radiation-sensitive composition includes: particles including a metal oxide as a principal component; and a radiation-sensitive base-generating agent, wherein a percentage content of metal atoms included in the composition with respect to an entirety of metal atoms and metalloid atoms included in the composition is no less than 50 atom %. A metal atom constituting the metal oxide preferably includes a zirconium atom, a hafnium atom, a chromium atom, a nickel atom, a cobalt atom, a tin atom, an indium atom, a titanium atom, a ruthenium atom, a tantalum atom, a tungsten atom, an iron atom, a copper atom, a zinc atom, an aluminum atom, a gallium atom, a thallium atom, a bismuth atom or a combination thereof. A pattern-forming method includes: applying the aforementioned radiation-sensitive composition on one face side of a substrate to form a film; exposing the film; and developing the film exposed.
Abstract:
A radiation-sensitive resin composition for forming a resist film includes a polymer including a first structural unit represented by a formula (1) and a second structural unit represented by a formula (2). The first structural unit and the second structural unit are included in an identical polymer molecule or different polymer molecules. R1 represents a hydrogen atom or a methyl group. Q represents a divalent linking group having 1 to 4 carbon atoms. X represents a monovalent lactone group. A part or all of hydrogen atoms included in the monovalent lactone group represented by X are not substituted or substituted. R2 represents a hydrogen atom or a methyl group. Y represents a monovalent lactone group. A part or all of hydrogen atoms included in the monovalent lactone group represented by Y are not substituted or substituted.
Abstract:
A radiation-sensitive composition includes a metal-containing component and an organic solvent. The metal-containing component includes particles including a metal oxide as a principal component. The metal-containing component includes at least two metal atoms which are different from one another, and a percentage content of the at least two metal atoms with respect to an entirety of metal atoms and metalloid atoms in the composition is no less than 50 atom %. The metal-containing component preferably includes: a first metal atom that is at least one selected from a titanium atom, a zirconium atom, a hafnium atom, a zinc atom, a tin atom and an indium atom; and a second metal atom that is at least one selected from a lanthanum atom and an yttrium atom.
Abstract:
A radiation-sensitive resin composition includes a compound represented by a following formula (1) and a base polymer. In the formula (1), R1 represents a monovalent cyclic organic group having a cyclic ester structure or a cyclic ketone structure; R2 represents a single bond or —CH2—; X is —O—*, —COO—*, —O—CO—O—* or —SO2-O—*, wherein * denotes a binding site to R3; R3 represents a bivalent chain hydrocarbon group having 1 to 5 carbon atoms; and M+ is a monovalent cation. The base polymer has a structural unit derived from (meth)acrylate that includes a lactone skeleton, a structural unit derived from (meth)acrylate that includes a cyclic carbonate skeleton, a structural unit derived from (meth)acrylate that includes a sultone skeleton, a structural unit derived from (meth)acrylate that includes a polar group, or a combination thereof. R1—R2—X—R3—CHF—CF2—SO3−M+ (1)
Abstract translation:辐射敏感性树脂组合物包含由下式(1)表示的化合物和基础聚合物。 式(1)中,R 1表示具有环状酯结构或环状酮结构的1价的环状有机基团, R 2表示单键或-CH 2 - ; X是-O-,-COO- *,-O-CO-O- *或-SO2-O- *,其中*表示与R3的结合位点; R3表示碳原子数为1〜5的二价链烃基; M +是一价阳离子。 基础聚合物具有衍生自包含内酯骨架的(甲基)丙烯酸酯的结构单元,衍生自包含环状碳酸酯骨架的(甲基)丙烯酸酯的结构单元,衍生自包含磺内酯骨架的(甲基)丙烯酸酯的结构单元, 衍生自包括极性基团的(甲基)丙烯酸酯的结构单元或其组合。 R1-R2-X-R3-CHF-CF2-SO3-M +(1)
Abstract:
A radiation-sensitive composition includes: particles including a metal oxide as a principal component; a radiation-sensitive acid generator; and an acid trapper, wherein a percentage content of silicon atoms with respect to an entirety of metal atoms in the composition is less than 50 atom %. The mean particle diameter of the particles is preferably no greater than 20 nm. A pattern-forming method includes: applying the aforementioned radiation-sensitive composition on a substrate to form a film; exposing the film; and developing the film exposed. A developer solution used in the developing is preferably an alkaline aqueous solution. A developer solution used in the developing may be an organic solvent-containing liquid. A radioactive ray used in the exposing is preferably an extreme ultraviolet ray or an electron beam.
Abstract:
A radiation-sensitive composition includes particles including a metal oxide as a principal component, a radiation-sensitive acid generator, and an organic solvent. A metal atom constituting the metal oxide includes a first metal atom that is a zinc atom, a boron atom, an aluminum atom, a gallium atom, a thallium atom, a germanium atom, an antimony atom, a bismuth atom, a tellurium atom, or a combination thereof. A van der Waals volume of an acid generated from the radiation-sensitive acid generator is no less than 2.0×10−28 m3. A percentage content of the first metal atom with respect to total metal atoms in the radiation-sensitive composition is no less than 50 atomic %.
Abstract:
A photoresist composition includes a polymer component that includes a first structural unit represented by the formula (1) and a second structural unit represented by the formula (2), an acid generator, and a compound represented by the formula (3). The first structural unit and the second structural unit are included in an identical polymer, or different polymers. R1 is hydrogen atom, fluorine atom, etc., R2 and R3 are independently hydrogen atom, fluorine atom, etc., a is an integer from 1 to 6, R4 and R5 independently hydrogen atom, fluorine atom, etc., R6 is hydrogen atom, fluorine atom, etc., R7 and R8 are each independently alkyl group having 1 to 4 carbon atoms, etc., R9 is alkyl group having 1 to 4 carbon atoms, etc., R10 is hydrogen atom, etc., A− is —N−—SO2—Ra, etc., and X+ is onium cation.
Abstract:
A radiation-sensitive resin composition includes a polymer, a radiation-sensitive acid generator, and a compound represented by formula (2). The polymer includes a first structural unit including a phenolic hydroxyl group, a second structural unit including a group represented by formula (1), and a third structural unit including an acid-labile group. In the formula (1), R1, R2, R3, R4, R5, and R6 each independently represent a hydrogen atom, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom, or a monovalent fluorinated hydrocarbon group having 1 to 10 carbon atoms, wherein at least one of R1, R2, R3, R4, R5, and R6 represents a fluorine atom or a fluorinated hydrocarbon group; RA represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and * denotes a binding site to a part other than the group represented by the formula (1).
Abstract:
A radiation-sensitive resin composition includes a first polymer including an acid-labile group, an acid generator to generate an acid upon exposure to radiation, and a second polymer including a fluorine atom and a functional group shown by a general formula (x). The second polymer has a fluorine atom content higher than a fluorine atom content of the first polymer. R1 represents an alkali-labile group. A represents an oxygen atom, —NR′—, —CO—O—# or —SO2—O—##, wherein the oxygen atom represented by A is not an oxygen atom bonded directly to an aromatic ring, a carbonyl group, or a sulfoxyl group, R′ represents a hydrogen atom or an alkali-labile group, and “#” and “##” each indicate a bonding hand bonded to R1. -A-R1 (x)
Abstract:
A resist pattern-forming method includes providing a resist film having a surface free energy of 30 to 40 mN/m on a substrate using a radiation-sensitive resin composition. The resist film is exposed by applying radiation via a mask. The exposed resist film is developed. It is preferable that the exposing of the resist film includes exposing the resist film via an immersion liquid that is provided over the resist film