发明申请
- 专利标题： CAPILLARY EXCHANGE SYSTEM OF SEMICONDUCTOR WIRE BONDING
- 专利标题（中）： 半导体线接头的毛细交换系统
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申请号： US13728316申请日： 2012-12-27
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公开(公告)号： US20130221071A1公开(公告)日： 2013-08-29
- 发明人: Young Sik KIM , Doo Jin KIM , Sung Bok HONG , Ki Taik OH
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR Suwon-Si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-Si
- 优先权： KR10-2012-0020308 20120228
- 主分类号： H01L21/67
- IPC分类号： H01L21/67
摘要：
A capillary exchange system of a semiconductor wire bonding includes a wire bond unit having a chuck that includes a holding portion for holding a capillary for semiconductor wire bonding, a holding release guide unit for mechanically acting on the chuck of the wire bond unit to allow the capillary to be held by the holding portion or released from the holding portion, and a capillary exchange unit for separating the capillary from the chuck of the wire bond unit and installing a new capillary in the chuck in cooperation with the holding release guide unit.
公开/授权文献
- US08672210B2 Capillary exchange system of semiconductor wire bonding 公开/授权日：2014-03-18
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