公开(公告)号：US20130221071A1

公开(公告)日：2013-08-29

申请号：US13728316

申请日：2012-12-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Sik KIM ,  Doo Jin KIM ,  Sung Bok HONG ,  Ki Taik OH

IPC: H01L21/67

CPC classification number: H01L21/67138 ,  B23K20/005 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78308 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A capillary exchange system of a semiconductor wire bonding includes a wire bond unit having a chuck that includes a holding portion for holding a capillary for semiconductor wire bonding, a holding release guide unit for mechanically acting on the chuck of the wire bond unit to allow the capillary to be held by the holding portion or released from the holding portion, and a capillary exchange unit for separating the capillary from the chuck of the wire bond unit and installing a new capillary in the chuck in cooperation with the holding release guide unit.

Abstract translation: 半导体引线接合的毛细管交换系统包括具有卡盘的引线接合单元，该卡盘包括用于保持用于半导体引线接合的毛细管的保持部分，用于机械地作用在引线接合单元的卡盘上的保持释放引导单元， 由保持部保持的毛细管或从保持部分释放的毛细管，以及毛细管交换单元，用于将毛细管与线接合单元的卡盘分离，并与保持释放引导单元配合地将新的毛细管安装在卡盘中。