Invention Application
- Patent Title: LIGHT-EMITTING SEMICONDUCTOR STRUCTURE AND OPTOELECTRONIC COMPONENT THEREFROM
- Patent Title (中): 发光二极管结构和光电子元件
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Application No.: US13688330Application Date: 2012-11-29
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Publication No.: US20130223464A1Publication Date: 2013-08-29
- Inventor: Martin Kittler , Tzanimir Arguirov , Manfred Reiche
- Applicant: IHP-GmbH- Innovations for High Performance
- Applicant Address: DE Frankfurt (Oder)
- Assignee: IHP-GmbH- Innovations for High Performance Microelectronics
- Current Assignee: IHP-GmbH- Innovations for High Performance Microelectronics
- Current Assignee Address: DE Frankfurt (Oder)
- Priority: DE102011087369.4 20111129; DE102012204987.8 20120328
- Main IPC: H01S5/30
- IPC: H01S5/30

Abstract:
A light emitting semiconductor device according the invention includes an SOI substrate, a collector and an injector. The SOI substrate includes a carrier layer, a buried oxide layer on the carrier layer, and a doped silicon layer structure with a conductivity type. The doped silicon layer structure with the conductivity type includes at least two silicon- or silicon germanium layers arranged adjacent to one another, wherein a dislocation network is configured in their interface portions at which dislocation network a radiative charge carrier combination with a light energy is provided, which light energy is smaller than a band gap energy of the silicon- or silicon germanium layers. The collector is formed as a pn-junction in a portion between the dislocation network and a surface of the silicon layer structure that is oriented away from the carrier layer, and wherein the injector is configured as a metal insulator semiconductor diode.
Public/Granted literature
- US09147998B2 Light-emitting semiconductor structure and optoelectronic component therefrom Public/Granted day:2015-09-29
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