Invention Application
US20130224661A1 PATTERN-FORMING METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION
有权
图案形成方法和辐射敏感性树脂组合物
- Patent Title: PATTERN-FORMING METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION
- Patent Title (中): 图案形成方法和辐射敏感性树脂组合物
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Application No.: US13855749Application Date: 2013-04-03
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Publication No.: US20130224661A1Publication Date: 2013-08-29
- Inventor: Hirokazu SAKAKIBARA , Masafumi HORI , Koji ITO , Reiko KIMURA , Taiichi FURUKAWA
- Applicant: JSR CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JSR CORPORATION
- Current Assignee: JSR CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2010-225259 20101004
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F7/004
Abstract:
A pattern-forming method includes coating a radiation-sensitive resin composition on a substrate to provide a resist film. The resist film is exposed. The exposed resist film is developed. A developer solution used in developing the exposed resist film includes no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a first polymer and a radiation-sensitive acid generator. The first polymer includes a first structural unit having an acid-labile group and an alicyclic group. The alicyclic group is capable of avoiding dissociation from a molecular chain by an action of an acid.
Public/Granted literature
- US09164387B2 Pattern-forming method, and radiation-sensitive resin composition Public/Granted day:2015-10-20
Information query
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