发明申请
- 专利标题: Semiconductor Devices and Manufacturing and Design Methods Thereof
- 专利标题(中): 半导体器件及其制造和设计方法
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申请号: US13410207申请日: 2012-03-01
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公开(公告)号: US20130228866A1公开(公告)日: 2013-09-05
- 发明人: Tung Ying Lee , Wen-Huie Guo , Chih-Hao Chang , Shou-Zen Chang
- 申请人: Tung Ying Lee , Wen-Huie Guo , Chih-Hao Chang , Shou-Zen Chang
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; G06F17/50 ; H01L21/8234
摘要:
Semiconductor devices and manufacturing and design methods thereof are disclosed. In one embodiment, a semiconductor device includes an active FinFET disposed over a workpiece comprising a first semiconductive material, the active FinFET comprising a first fin. An electrically inactive FinFET structure is disposed over the workpiece proximate the active FinFET, the electrically inactive FinFET comprising a second fin. A second semiconductive material is disposed between the first fin and the second fin.
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