发明申请
US20130240958A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME 审中-公开
半导体结构及其形成方法

  • 专利标题: SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
  • 专利标题(中): 半导体结构及其形成方法
  • 申请号: US13521051
    申请日: 2012-05-29
  • 公开(公告)号: US20130240958A1
    公开(公告)日: 2013-09-19
  • 发明人: Jing WangLei GuoWei Wang
  • 申请人: Jing WangLei GuoWei Wang
  • 优先权: CN201210065893.9 20120313; CN201210161250.4 20120522
  • 国际申请: PCT/CN12/76240 WO 20120529
  • 主分类号: H01L29/78
  • IPC分类号: H01L29/78 H01L21/336
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
摘要:
A semiconductor structure and a method for forming the same are provided. The semiconductor structure comprises: a semiconductor substrate; an active region formed in the semiconductor substrate, in which the active region comprises: a channel region, and a source region and a drain region formed on both sides of the channel region respectively; and a first isolation trench formed in the semiconductor substrate and on both sides of the active region, in which a first rare earth oxide layer is formed in each first isolation trench to produce a stress in the channel region in a channel length direction.
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/66 .按半导体器件的类型区分的
H01L29/68 ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的(H01L29/96优先)
H01L29/76 ...单极器件
H01L29/772 ....场效应晶体管
H01L29/78 .....由绝缘栅产生场效应的
0/0