发明申请
US20130285143A1 Integrated Circuit Devices Including Stress Proximity Effects and Methods of Fabricating the Same 有权
包括应力接近效应的集成电路器件及其制造方法

Integrated Circuit Devices Including Stress Proximity Effects and Methods of Fabricating the Same
摘要:
An integrated circuit can include first and second FETs of a particular conductivity type on a substrate, wherein a first source/drain region of the first FET is closer to a center of a first channel region of the first FET than a second source/drain region of the second FET is to a center of a second channel region of the second FET.
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