发明申请
- 专利标题： Package Structure and Substrate Bonding Method
- 专利标题（中）： 封装结构和基板接合方法
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申请号： US13836807申请日： 2013-03-15
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公开(公告)号： US20130285248A1公开(公告)日： 2013-10-31
- 发明人: Hung-Lin Yin , Jerwei Hsieh , Li-Yuan Lin
- 申请人： ASIA PACIFIC MICROSYSTEMS, INC.
- 申请人地址： TW Hsinchu City
- 专利权人： Asia Pacific Microsystems, Inc.
- 当前专利权人： Asia Pacific Microsystems, Inc.
- 当前专利权人地址： TW Hsinchu City
- 优先权： TW101114983 20120426
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/762
摘要：
A substrate bonding method comprises the following steps. Firstly, a first substrate and a second substrate are provided, wherein a surface of the first substrate is covered by a first Ag layer and a surface of the second substrate is covered by a second Ag layer and a metallic layer from bottom to top, wherein the metallic layer comprises a first Sn layer. Secondly, a bonding process is performed by aligning the first and second substrates followed by bringing the metallic layer into contact with the first Ag layer followed by applying a load while heating to a predetermined temperature in order to form Ag3Sn intermetallic compounds. Finally, cool down and remove the load to complete the bonding process.
公开/授权文献
- US08916449B2 Package structure and substrate bonding method 公开/授权日：2014-12-23
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