Invention Application
- Patent Title: RADIATION-SENSITIVE RESIN COMPOSITION AND COMPOUND
- Patent Title (中): 辐射敏感性树脂组合物和化合物
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Application No.: US13929357Application Date: 2013-06-27
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Publication No.: US20130288179A1Publication Date: 2013-10-31
- Inventor: Kazuo NAKAHARA , Ken MARUYAMA
- Applicant: JSR CORPORATION
- Priority: JP2010-293362 20101228
- Main IPC: G03F7/004
- IPC: G03F7/004

Abstract:
A radiation-sensitive resin composition includes a compound represented by a formula (1), and a polymer that includes a structural unit having an acid-labile group. R1 and R4 each independently represent a hydrogen atom, or the like. R2 and R3 each independently represent a hydrogen atom or the like. X1 and X2 each independently represent a hydrogen atom, or the like, or X1 and X2 taken together represent —S—, —O—, —SO2—, or the like. A represents an ethanediyl group, wherein at least one hydrogen atom included in X1, X2 and A is substituted by —Y—SO3−M+. Y represents an alkanediyl group having 1 to 10 carbon atoms, or the like. M+ represents a monovalent onium cation. In the case where —Y—SO3−M+ is present in a plurality of number, a plurality of Ys are each identical or different and a plurality of M+s are each identical or different.
Public/Granted literature
- US09304393B2 Radiation-sensitive resin composition and compound Public/Granted day:2016-04-05
Information query
IPC分类: