Invention Application
- Patent Title: APPARATUS FOR SUBSTRATE TREATMENT AND HEATING APPARATUS
- Patent Title (中): 基板处理和加热装置的装置
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Application No.: US13886261Application Date: 2013-05-02
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Publication No.: US20130294756A1Publication Date: 2013-11-07
- Inventor: Il-Hwan LIM , Jang-Woo SHIM , Chul-Soo KIM , Seung-Ae CHOI
- Applicant: AP SYSTEMS INC.
- Applicant Address: KR Hwaseong-Si
- Assignee: AP SYSTEMS INC.
- Current Assignee: AP SYSTEMS INC.
- Current Assignee Address: KR Hwaseong-Si
- Priority: KR10-2012-0046713 20120503
- Main IPC: H01L21/67
- IPC: H01L21/67

Abstract:
The present invention relates to an apparatus for heat-treating a substrate, and more particularly to an apparatus for substrate treatment to perform a heat treatment of a substrate for a flat panel display panel.An apparatus for substrate treatment according to an embodiment of the present invention comprises a processing chamber having a substrate treatment space; a heating housing having a heating lamp that emits radiant energy and a reflecting block that reflects radiant energy emitted from the heating lamp; and a window that maintains a sealing between the processing chamber and the heating housing and transmits the radiant energy to a substrate.
Public/Granted literature
- US09318359B2 Apparatus for substrate treatment and heating apparatus Public/Granted day:2016-04-19
Information query
IPC分类: