发明申请
US20130323907A1 ACTIVE CARRIER FOR CARRYING A WAFER AND METHOD FOR RELEASE 审中-公开
用于承载波浪的主动载波和释放方法

ACTIVE CARRIER FOR CARRYING A WAFER AND METHOD FOR RELEASE
摘要:
In the field of release and pickup of ultrathin semiconductor dies, there is provided an active carrier (1) for carrying a wafer (20) and a method for using such a carrier (1). The wafer (20) comprises a particular die arrangement (P). The active carrier (1) comprises a base plate (2) and a number of energizers (7) constructed on or in this base plate (2). The energizers (7) are laid out in an arrangement corresponding to the die arrangement (P). The energizers (7) can locally energize an adhesive layer (3) in proximity to a selected die (14) from the die arrangement (P). By this local energizing of the adhesive layer (P), the selected die is loosened from the adhesive layer (3). Furthermore the active carrier (1) comprises a plurality of externally addressable contacts (12) and conduction pathways (9). The conduction pathways (9) connect the contacts (12) to the energizers (7) thereby allowing individual control over said energizers (7) by addressing said contacts (12).
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