Invention Application
- Patent Title: HEAT TRANSFER SHEET ADHERING APPARATUS AND METHOD
- Patent Title (中): 热转印装置和方法
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Application No.: US13937254Application Date: 2013-07-09
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Publication No.: US20140008010A1Publication Date: 2014-01-09
- Inventor: Toshinori KITABATA , Kazuya MATSUMOTO
- Applicant: TOKYO ELECTRON LIMITED
- Priority: JP2012-153905 20120709
- Main IPC: B29C65/00
- IPC: B29C65/00

Abstract:
A heat transfer sheet adhering apparatus, for adhering a heat transfer sheet to a ring-shaped member adapted to be used in a substrate processing apparatus, includes a heat transfer sheet mounting part configured to mount the heat transfer sheet thereon; a ring-shaped member supporting part configured to support the ring-shaped member; and a vertically movable pressing part configured to press the ring-shaped member supported by the ring-shaped member supporting part against the heat transfer sheet mounted on the heat transfer sheet mounting part. The pressing part is configured to press the ring-shaped member gradually from an inner peripheral side to an outer peripheral side of the ring-shaped member or from the outer peripheral side to the inner peripheral side of the ring-shaped member.
Public/Granted literature
- US09427913B2 Heat transfer sheet adhering apparatus and method Public/Granted day:2016-08-30
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