公开(公告)号：US20150114564A1

公开(公告)日：2015-04-30

申请号：US14527464

申请日：2014-10-29

Applicant: TOKYO ELECTRON LIMITED

Inventor： Toshinori KITABATA ,  Yusuke HAYASAKA ,  Kazuya MATSUMOTO

IPC: H01L21/677 ,  H01L21/67

Abstract: In a substrate processing apparatus of the present disclosure, a bearing member includes a decaying mechanism provided with a connecting shaft inserted therein and configured to decay radicals or ions; a first member configured to cover the decaying mechanism; and a second member disposed at the connecting shaft and provided with the connecting shaft inserted therein while being in contact with a sealing member. Further, an end of the first member and an end of the second member are connected to be engaged with each other, an invasion path is formed to allow the radicals to invade from the connected portion of the end of the first member and the end of the second member, and the invasion path is formed to be folded back in an extending direction of the connecting shaft. The sealing member is made of a material having a tensile strength larger than 12.1 MPa.

Abstract translation: 在本公开的基板处理装置中，轴承部件包括设置有插入其中的连接轴的衰减机构，其构造为使自由基或离子衰变; 构造成覆盖衰减机构的第一构件; 以及第二构件，其设置在连接轴处并且设置有与密封构件接触的插入其中的连接轴。 此外，第一构件的端部和第二构件的端部被连接以彼此接合，形成侵入路径以允许自由基从第一构件的端部的连接部分入侵，并且第二构件的端部 第二构件和侵入路径形成为在连接轴的延伸方向上折回。 密封构件由拉伸强度大于12.1MPa的材料制成。

公开(公告)号：US20150162170A1

公开(公告)日：2015-06-11

申请号：US14564371

申请日：2014-12-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroki KISHI ,  Masaaki MIYAGAWA ,  Toshinori KITABATA ,  Manabu IWATA

IPC: H01J37/32

CPC classification number: H01J37/32642 ,  H01J37/32715

Abstract: A degree of tilting caused by consumption of a focus ring can be suppressed. A plasma processing apparatus includes a chamber configured to perform a plasma process on a target object; a mounting table which is provided within the chamber and has a mounting surface on which the target object is mounted; and the focus ring, provided on the mounting table to surround the target object mounted on the mounting surface, having a first flat portion lower than the mounting surface, a second flat portion higher than the first flat portion and not higher than a target surface of the target object, and a third flat portion higher than the second flat portion and the target surface of the target object in sequence from an inner peripheral side thereof to an outer peripheral side thereof.

Abstract translation: 可以抑制由焦点环的消耗引起的倾斜度。 等离子体处理装置包括：室，被配置为对目标物体执行等离子体处理; 安装台，其设置在所述室内并且具有安装所述目标物体的安装面; 以及设置在所述安装台上的聚焦环，以围绕安装在所述安装面上的所述目标物体，具有比所述安装面低的第一平坦部，比所述第一平坦部高的第二平坦部， 目标物体和比目标物体的第二平坦部分和目标物体的目标表面高的第三平坦部分，从其内周侧到外周侧。

公开(公告)号：US20140008010A1

公开(公告)日：2014-01-09

申请号：US13937254

申请日：2013-07-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Toshinori KITABATA ,  Kazuya MATSUMOTO

IPC: B29C65/00

CPC classification number: B29C66/472 ,  B29C65/7841 ,  B29C66/24221 ,  B29C66/342 ,  B29C66/345 ,  B29C66/4722 ,  B29C66/71 ,  B29C66/742 ,  B29C66/7422 ,  B29C66/81417 ,  B29C66/81427 ,  B29C66/81463 ,  B29C66/8161 ,  B29C66/8223 ,  B29C66/8322 ,  H01L21/67092 ,  H01L21/67132 ,  B29K2083/00

Abstract: A heat transfer sheet adhering apparatus, for adhering a heat transfer sheet to a ring-shaped member adapted to be used in a substrate processing apparatus, includes a heat transfer sheet mounting part configured to mount the heat transfer sheet thereon; a ring-shaped member supporting part configured to support the ring-shaped member; and a vertically movable pressing part configured to press the ring-shaped member supported by the ring-shaped member supporting part against the heat transfer sheet mounted on the heat transfer sheet mounting part. The pressing part is configured to press the ring-shaped member gradually from an inner peripheral side to an outer peripheral side of the ring-shaped member or from the outer peripheral side to the inner peripheral side of the ring-shaped member.

Abstract translation: 一种用于将传热片粘附到适用于基板处理设备的环形部件的传热片粘合装置，包括：传热片安装部，其构造成将传热片安装在其上; 环状构件支撑部，其构造成支撑所述环状构件; 以及可垂直移动的按压部，其构造成将由环状构件支撑部支撑的环状构件压靠在安装在传热片安装部上的传热片上。 按压部构造为从环状部件的内周侧到外周侧或从环状部件的外周侧到内周侧逐渐地按压环状部件。