PLASMA PROCESSING APPARATUS
    1.
    发明申请

    公开(公告)号:US20220384154A1

    公开(公告)日:2022-12-01

    申请号:US17804027

    申请日:2022-05-25

    Abstract: In a disclosed plasma processing apparatus, an electrostatic chuck provided in a chamber includes a first region on which a substrate is placed and a second region on which an edge ring is placed. The first region includes a first electrode provided therein. The second region including a second electrode provided therein. A first feed line connects the first electrode and a bias power supply generating a pulse of a voltage applied to the first electrode to each other. A second feed line connects the second electrode and the bias power supply or another bias power supply generating a pulse of the voltage applied to the second electrode to each other. The second feed line includes one or more sockets and one or more feed pins. The one or more feed pins have flexibility in a radial direction thereof and are fitted into the one or more sockets.

    MAINTENANCE METHOD OF PLASMA PROCESSING APPARATUS

    公开(公告)号:US20190131137A1

    公开(公告)日:2019-05-02

    申请号:US16094986

    申请日:2017-04-10

    Abstract: A plasma processing apparatus includes a support structure configured to support a workpiece and a first drive device configured to rotate the support structure about a first axis extending in a direction orthogonal to a vertical direction. The support structure includes a holding unit including an electrostatic chuck and a container provided under the holding unit. The container includes a tubular container body, and a bottom cover configured to close a bottom side opening of the container body and to be detachable from the container body. A maintenance method includes: rotating a support structure about a first axis such that the bottom cover is positioned above an electrostatic chuck, removing the bottom cover from the container body, and maintaining a component provided in the container body.

    METHOD OF ETCHING OBJECT TO BE PROCESSED
    3.
    发明申请

    公开(公告)号:US20180337025A1

    公开(公告)日:2018-11-22

    申请号:US15775218

    申请日:2016-11-11

    Abstract: A method MT includes etching a wafer W using plasma generated in a processing container. The etching includes a process of inclining and rotating a holding structure holding the wafer W during execution of the etching and the process successively creating a plurality of inclined rotation states RT(φ, t) with respect to the holding structure. In the inclined rotation states, the wafer W is rotated about a central axis of the wafer W over a predetermined process time while maintaining a state where the central axis is inclined with respect to a reference axis of the processing container which is in the same plane as the central axis. A combination of a value φ of an inclination angle AN of the central axis with respect to the reference axis and the process time t differs for each of the plurality of inclined rotation states.

    SUBSTRATE PROCESSING APPARATUS AND SHUTTER MEMBER
    5.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SHUTTER MEMBER 审中-公开
    基板加工装置和快门部件

    公开(公告)号:US20150114564A1

    公开(公告)日:2015-04-30

    申请号:US14527464

    申请日:2014-10-29

    Abstract: In a substrate processing apparatus of the present disclosure, a bearing member includes a decaying mechanism provided with a connecting shaft inserted therein and configured to decay radicals or ions; a first member configured to cover the decaying mechanism; and a second member disposed at the connecting shaft and provided with the connecting shaft inserted therein while being in contact with a sealing member. Further, an end of the first member and an end of the second member are connected to be engaged with each other, an invasion path is formed to allow the radicals to invade from the connected portion of the end of the first member and the end of the second member, and the invasion path is formed to be folded back in an extending direction of the connecting shaft. The sealing member is made of a material having a tensile strength larger than 12.1 MPa.

    Abstract translation: 在本公开的基板处理装置中,轴承部件包括设置有插入其中的连接轴的衰减机构,其构造为使自由基或离子衰变; 构造成覆盖衰减机构的第一构件; 以及第二构件,其设置在连接轴处并且设置有与密封构件接触的插入其中的连接轴。 此外,第一构件的端部和第二构件的端部被连接以彼此接合,形成侵入路径以允许自由基从第一构件的端部的连接部分入侵,并且第二构件的端部 第二构件和侵入路径形成为在连接轴的延伸方向上折回。 密封构件由拉伸强度大于12.1MPa的材料制成。

    PLASMA PROCESSING APPARATUS
    6.
    发明申请

    公开(公告)号:US20190131158A1

    公开(公告)日:2019-05-02

    申请号:US16094920

    申请日:2017-04-10

    Abstract: A plasma processing apparatus includes a chamber body that provides a chamber, a support structure which supports a workpiece inside the chamber body, and a first drive device which rotates the support structure inside the chamber body about a first axis that extends in a direction orthogonal to the vertical direction. The support structure includes a holding unit including an electrostatic chuck which holds the workpiece and which is rotatable around a second axis orthogonal to the first axis, a container provided below the holding unit, and a second drive device which rotates the holding unit around the second axis. The container has a cylindrical container body and a bottom cover configured to close a bottom side opening in the container body. The bottom cover is detachable from the container body.

    HEAT TRANSFER SHEET ADHERING APPARATUS AND METHOD
    7.
    发明申请
    HEAT TRANSFER SHEET ADHERING APPARATUS AND METHOD 有权
    热转印装置和方法

    公开(公告)号:US20140008010A1

    公开(公告)日:2014-01-09

    申请号:US13937254

    申请日:2013-07-09

    Abstract: A heat transfer sheet adhering apparatus, for adhering a heat transfer sheet to a ring-shaped member adapted to be used in a substrate processing apparatus, includes a heat transfer sheet mounting part configured to mount the heat transfer sheet thereon; a ring-shaped member supporting part configured to support the ring-shaped member; and a vertically movable pressing part configured to press the ring-shaped member supported by the ring-shaped member supporting part against the heat transfer sheet mounted on the heat transfer sheet mounting part. The pressing part is configured to press the ring-shaped member gradually from an inner peripheral side to an outer peripheral side of the ring-shaped member or from the outer peripheral side to the inner peripheral side of the ring-shaped member.

    Abstract translation: 一种用于将传热片粘附到适用于基板处理设备的环形部件的传热片粘合装置,包括:传热片安装部,其构造成将传热片安装在其上; 环状构件支撑部,其构造成支撑所述环状构件; 以及可垂直移动的按压部,其构造成将由环状构件支撑部支撑的环状构件压靠在安装在传热片安装部上的传热片上。 按压部构造为从环状部件的内周侧到外周侧或从环状部件的外周侧到内周侧逐渐地按压环状部件。

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