发明申请
- 专利标题： BUMP-ON-TRACE PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- 专利标题（中）： 防撞包装结构及其形成方法
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申请号： US13544783申请日： 2012-07-09
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公开(公告)号： US20140008786A1公开(公告)日： 2014-01-09
- 发明人: Meng-Tse Chen , Wei-Hung Lin , Chih-Wei Lin , Kuei-Wei Huang , Hui-Min Huang , Ming-Da Cheng , Chung-Shi Liu
- 申请人： Meng-Tse Chen , Wei-Hung Lin , Chih-Wei Lin , Kuei-Wei Huang , Hui-Min Huang , Ming-Da Cheng , Chung-Shi Liu
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/60
摘要：
A device comprises a first package component, and a first metal trace and a second metal trace on a top surface of the first package component. The device further includes a dielectric mask layer covering the top surface of the first package component, the first metal trace and the second metal trace, wherein the dielectric mask layer has an opening therein exposing the first metal trace. The device also includes a second package component and an interconnect formed on the second package component, the interconnect having a metal bump and a solder bump formed on the metal bump, wherein the solder bump contacts the first metal trace in the opening of the dielectric mask layer.